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DTSTART;VALUE=DATE:20250330
DTEND;VALUE=DATE:20250405
DTSTAMP:20250217T215400Z
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SUMMARY:EuCAP 2025
DESCRIPTION:EuCAP is the largest antennas and propagation conference in Europe. It attracts more than 1500 participants from academia and industry\, and more than 50 industrial exhibitors from all over the world. It is a great forum for exchanging new technical-scientific achievements\, demonstrating state-of-the-art technology\, and establishing and strengthening professional networks. Leveraging from the strong academic and industrial base at the host country in antennas and propagation\, EuCAP 2025 will showcase the latest technological and scientific discoveries in this field\, making links with local strengths on 5G/6G\, radar\, and non-terrestrial network technologies. \nMicrosanj and our partner eV-Technologies are pleased to announce that we will be presenting in a convened session\, “Fast\, low-invasive visualization of EM-VNF distributions around wireless communication/sensing devices: from anechoic chamber to microscope\,” at EuCAP 2025 in Stockholm\, Sweden. Please check back here for more details. \nTo learn more or to register\, view the event website.
URL:https://microsanj.com/events/eucap-2025/
LOCATION:Stockholm Waterfront Congress Centre\, Nils Ericsons Plan 4\, 111 64\, Stockholm\, Sweden
CATEGORIES:Trade Shows
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DTSTART;TZID=UTC:20250421T140000
DTEND;TZID=UTC:20250421T160000
DTSTAMP:20250414T182406Z
CREATED:20250409T141649Z
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SUMMARY:Microsanj Seminar at ASU Macro Technology Works (MTW)
DESCRIPTION:You’re Invited!Discover Next-Generation Thermal Analysis with Microsanj at MTW \n📅 April 21st📍 MTW-2061 \nJoin Microsanj\, a Swap Hub Member\, for a special session at MTW!We’ll explore our cutting-edge optical thermal analysis technology designed for today’s most advanced electronics. From semiconductors to AI and quantum systems\, discover how our method delivers unmatched thermal insight across a wide range of applications. \nApplications Covered:\n\nSemiconductor Device Analysis: Detect hotspots\, measure thermal resistance\, and enhance reliability.\nAdvanced Packaging: Map thermal interfaces and identify defects in TSVs and stacked die.\nRF\, 5G & 6G Devices: Analyze heating in high-frequency components.\nPhotonics & Optoelectronics: Characterize thermal behavior in waveguides\, modulators\, and photodetectors.\nPower Electronics: Validate thermal designs for GaN and wide bandgap devices.\nThermal Interface Materials Testing: Play a role in transferring heat between electronic components and heat sinks.\nMicroelectronics Security & Fault Analysis: Help identify tampering\, reverse engineering\, and defects.\nBiomedical Imaging: Allow researchers to visualize heat in tissues\, track changes\, and assess medical device effects.\nAI & Quantum Computing Applications: Excess heat affects stability\, performance\, and lifespan\, making it essential.\n\nKey Advantages:\n\n250 nm Spatial Resolution – Detects submicron hot spots\n500 Picosecond Transient Response – Captures ultra-fast thermal events\nSeamless Integration – Ideal for RF\, photonics\, and semiconductor workflows\nNon-Destructive Characterization – Gain thermal insight without altering your device\nDon’t miss this opportunity to explore the future of thermal analysis!\n\n👉 Register Now to reserve your spot. Contact Ruth Gebru for any questions.
URL:https://microsanj.com/events/microsanj-seminar-at-asu-macro-technology-works-mtw/
LOCATION:Arizona State University Macro Technology Works (MTW-2061)\, 7700 S River Pkwy\, Tempe\, AZ\, 85284
CATEGORIES:Seminar
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