BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Microsanj - ECPv6.18.2//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://microsanj.com
X-WR-CALDESC:Events for Microsanj
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:UTC
BEGIN:STANDARD
TZOFFSETFROM:+0000
TZOFFSETTO:+0000
TZNAME:UTC
DTSTART:20250101T000000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261013
DTEND;VALUE=DATE:20261016
DTSTAMP:20260917T152945Z
CREATED:20260622T200807Z
LAST-MODIFIED:20260917T152945Z
UID:2463-1791849600-1792108799@microsanj.com
SUMMARY:SEMICON West 2026
DESCRIPTION:Microsanj is heading to SEMICON West in San Francisco\, CA! Join the world’s leading semiconductor companies\, innovators\, engineers\, and researchers shaping the future of microelectronics — and stop by booth #6763 to see us. \nExhibit Hours: \n\nTuesday\, October 13\, 2026 (10:00 am – 5:00 pm)\nWednesday\, October 14\, 2026 (10:00 am – 5:00 pm)\nThursday\, October 15\, 2026 (10:00 am – 4:00 pm)\n\nPresentation:\nJoin us at the APHI Summit – Day 1 (AM) for a featured talk from Mo Shakouri of Microsanj.\nSession: Power & Thermals I — Thermal is the New Node: Managing Power in 3D Systems \nTalk Title: Laser-Based TDTR and Thermoreflectance Imaging for Hybrid Bonding\, TSV Integrity\, and Co-Packaged Optics in 3DHI \nDate: Tuesday\, October 13\, 2026\nSession Time: 10:30 AM – 12:30 PM\nMo Shakouri’s Talk: 11:45 AM – 12:05 PM\nLocation: Room 156\, Moscone Center\, South Hall\, Upper Mezzanine \nView Floorplan \nRegister for a complimentary single-day Expo Pass
URL:https://microsanj.com/events/semicon-west-2026/
LOCATION:Moscone Center\, 747 Howard St\, San Francisco\, CA\, 94103\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/09/Semicon-West-Logo-e1788889939847.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261201
DTEND;VALUE=DATE:20261205
DTSTAMP:20261021T191229Z
CREATED:20261021T191229Z
LAST-MODIFIED:20261021T191229Z
UID:3104-1796083200-1796428799@microsanj.com
SUMMARY:EPTC 2026
DESCRIPTION:The IEEE Electronics Packaging Technology Conference (EPTC) is an annual international event organized by the IEEE RS/EPS/EDS Singapore Joint Chapter and co-sponsored by the IEEE Electronics Packaging Society (EPS)\, and it will be held in Singapore. \nAli Shakouri will be presenting “3D Depth Analysis of Multilayer Thermal Materials and Packages.” Please check back here for more details. \nRegister Now
URL:https://microsanj.com/events/eptc-2026/
LOCATION:Sands Expo & Convention Centre\, 10 Bayfront Ave\, 018956\, Singapore
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/10/Logo-e1792609940405.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261206
DTEND;VALUE=DATE:20261210
DTSTAMP:20261021T201307Z
CREATED:20261021T191855Z
LAST-MODIFIED:20261021T201307Z
UID:3108-1796515200-1796860799@microsanj.com
SUMMARY:IEEE-IDSPS 2026
DESCRIPTION:The IEEE-IDSPS conference covers all design\, semiconductor\, packaging\, and system technologies from science to technology to manufacturing\, supporting India’s transition into a product nation. \nOur Co-Founder & CEO\, Mo Shakouri\, will be presenting “Meeting Emerging Thermal Challenges of 3D Heterogeneously\nIntegrated Circuit Packaging Techniques.” Please check back here for more details. \nRegister Now
URL:https://microsanj.com/events/ieee-idsps-2026/
LOCATION:Novotel Visakhapatnam\, Beach Rd\, Krishna Nagar\, Maharani Peta\, Visakhapatnam\, Andhra Pradesh\, 530002\, India
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/jpeg:https://microsanj.com/wp-content/uploads/2026/10/IDSPS-logo-e1792610399981.jpg
END:VEVENT
END:VCALENDAR