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X-WR-CALDESC:Events for Microsanj
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DTSTART:20240101T000000
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20260527
DTEND;VALUE=DATE:20260528
DTSTAMP:20260501T162834Z
CREATED:20260501T162718Z
LAST-MODIFIED:20260501T162834Z
UID:2111-1779840000-1779926399@microsanj.com
SUMMARY:Benelux RF&IC Conference 2026
DESCRIPTION:Our international representative\, CNROOD\, has taken on the role of a Gold Sponsor at the Benelux RF & IC Conference 2026. This premier event is an exhibition and conference on advanced chip development in the Low Countries\, bringing together the RF\, analog & mixed-signal\, and digital communities \nAs part of their sponsorship\, CNROOD will proudly represent Microsanj at the conference\, showcasing our cutting-edge solutions and expertise. We invite attendees to connect with the CNROOD team to learn more about our innovative thermal analysis tools and their applications in RF and microwave technologies. \nIf you would like to learn more or to register\, you can view the event website.
URL:https://microsanj.com/events/benelux-rfic-conference-2026/
LOCATION:Mikrocentrum\, De Run 1115\, 5503 LB De Run 1115\, 5503 LB\, Veldhoven\, Netherlands
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/05/Benelux-RFIC-2026-logo-rgb-150-e1777652833318.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260527
DTEND;VALUE=DATE:20260528
DTSTAMP:20260514T141831Z
CREATED:20260429T201814Z
LAST-MODIFIED:20260514T141831Z
UID:2097-1779840000-1779926399@microsanj.com
SUMMARY:Multiphysics Characterization of GaN and Wide‑Bandgap RF Devices: Correlating Pulsed‑IV\, RF\, and Thermoreflectance Thermal Imaging Measurements (Technical Webinar)
DESCRIPTION:Exploring how multiphysics approaches are unlocking new understanding of GaN\, SiC\, and next-generation semiconductor devices. \n\n\n\n\nEvent Details\n\nDate: Wednesday\, May 27\, 2026\nLocation: Virtual\nTime: 7:00 AM – 8:00 AM PDT & 7:00 PM – 8:00 PM PDT\n\n\n\n\nLearn More & Register Now
URL:https://microsanj.com/events/technical-webinar-may-27-2026-multiphysics-characterization-of-gan-and-wide-bandgap-rf-devices-correlating-pulsed-iv-rf-and-thermoreflectance-thermal-imaging-measurement/
LOCATION:Virtual
CATEGORIES:Webinar
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/04/Webinar-Social-Media-Image-e1777493935499.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260526
DTEND;VALUE=DATE:20260530
DTSTAMP:20260420T210814Z
CREATED:20260323T153141Z
LAST-MODIFIED:20260420T210814Z
UID:1956-1779753600-1780099199@microsanj.com
SUMMARY:ECTC 2026
DESCRIPTION:The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging\, components\, and microelectronic systems science\, technology\, and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT). \nWe’re proud to announce our sponsorship of the 2026 IEEE EPS Heterogeneous Integration Roadmap (HIR) Workshop at ECTC in Orlando\, FL. \nThis full-day workshop on Tuesday\, May 26 brings together leaders in advanced packaging to discuss the technologies shaping our industry’s future. The day features four technical sessions covering topics including Additive Electronics Manufacturing (AME) for Advanced Packaging and CHIPS R&D Metrology\, chaired by Ravi Mahajan of Intel Corporation and William Chen of ASE. \nAs thermal imaging plays an increasingly critical role in heterogeneous integration and advanced packaging\, Microsanj is honored to support the important work happening in this space. \nRegister Now \nSchedule a meeting with us \n 
URL:https://microsanj.com/events/ectc-2026/
LOCATION:JW Marriott Orlando\, Grande Lakes\, 4040 Central Florida Parkway\, Orlando\, FL\, 32837\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/03/ectclogo-circle-2026-year-e1774279917900.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260526
DTEND;VALUE=DATE:20260530
DTSTAMP:20260427T175040Z
CREATED:20260323T152549Z
LAST-MODIFIED:20260427T175040Z
UID:1952-1779753600-1780099199@microsanj.com
SUMMARY:ITherm 2026
DESCRIPTION:We’re pleased to announce that we are gold sponsors. Come visit us on the exhibit floor for a demo\, and don’t miss our sponsored presentation on Friday\, May 29\, from 11:30–11:45 AM in Room 3. \nITherm 2026 will be held alongside the 76th Electronic Components and Technology Conference (ECTC 2026 – http://www.ectc.net)\, a premier electronics packaging conference\, at the JW Marriott Orlando\, Grande Lakes\, Orlando\, Florida\, USA. Joint registrations will be available at a discounted rate. In addition to paper presentations and vendor exhibits\, ITherm 2026 will include panel discussions\, keynote lectures by prominent speakers\, invited technology talks\, ECTC/ITherm joint networking events and short courses\, and a student design competition. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/itherm-2026/
LOCATION:JW Marriott Orlando\, Grande Lakes\, 4040 Central Florida Parkway\, Orlando\, FL\, 32837\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/03/Screenshot-2026-03-23-at-8.22.18-AM-e1774279583707.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260522
DTEND;VALUE=DATE:20260523
DTSTAMP:20260501T162853Z
CREATED:20260501T162336Z
LAST-MODIFIED:20260501T162853Z
UID:2103-1779408000-1779494399@microsanj.com
SUMMARY:Benelux Heterogeneous Integration Conference 2026
DESCRIPTION:Our international representative\, CNROOD\, has taken on the role of a Bronze Sponsor at the Benelux Heterogeneous Integration Conference 2026. This premier event is an exhibition and conference on advanced semiconductor systems development in the Low Countries\, bringing together the semiconductor\, optical communication\, photonics\, and equipment communities\, focusing on advanced packaging \nAs part of their sponsorship\, CNROOD will proudly represent Microsanj at the conference\, showcasing our cutting-edge solutions and expertise. We invite attendees to connect with the CNROOD team to learn more about our innovative thermal analysis tools and their applications in RF and microwave technologies. \nIf you would like to learn more or to register\, you can view the event website.
URL:https://microsanj.com/events/benelux-heterogeneous-integration-conference-2026/
LOCATION:Mikrocentrum\, De Run 1115\, 5503 LB De Run 1115\, 5503 LB\, Veldhoven\, Netherlands
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/05/BHIC-logo-L-e1777652611938.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260518
DTEND;VALUE=DATE:20260522
DTSTAMP:20260427T174659Z
CREATED:20260226T175923Z
LAST-MODIFIED:20260427T174659Z
UID:1881-1779062400-1779407999@microsanj.com
SUMMARY:CS Mantech 2026 - International Conference on Compound Semiconductor Manufacturing Technology
DESCRIPTION:Microsanj will be exhibiting at Booth #213 for a live demo showcasing GaN thermal imaging with our EZ THERM system. It’s the perfect opportunity to see the technology in action and meet the team. We’d love to chat about how our solutions can support your work. \nExhibit Hours: \n\nTuesday\, May 19th (7:00 AM – 5:00 PM)\nWednesday\, May 20th (7:00 AM – 1:30 PM)\n\nMicrosanj will also be presenting at the exhibits forum on Tuesday\, May 19th\, happening from 5:00 PM – 6:00 PM at Salons A – D (Lower Level I). \nCS MANTECH is a not-for-profit organization whose focus is to provide a forum for members of the compound semiconductor community to exchange and discuss new ideas to better serve the public in general. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/cs-mantech-2026-international-conference-on-compound-semiconductor-manufacturing-technology/
LOCATION:Portland Marriott Downtown Waterfront\, 1401 SW Naito Pkwy\, Portland\, OR\, 97201\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/02/cs-mantech-logo-e1772223404979.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260429
DTEND;VALUE=DATE:20260501
DTSTAMP:20260311T165238Z
CREATED:20260311T165006Z
LAST-MODIFIED:20260311T165238Z
UID:1905-1777420800-1777593599@microsanj.com
SUMMARY:SEMIEXPO Heartland 2026
DESCRIPTION:Dr. Mo Shakouri will be a part of Session 3: Thermal Management & Power Delivery in Advanced Packaging: From TIMs to Warpage Control by presenting Meeting Emerging Thermal Challenges of 3D Heterogeneously Integrated Circuit Packaging Techniques on Thursday\, April 30\, from 10:05 AM – 10:25 AM. \nSEMIEXPO Heartland 2026 brings together the automotive and semiconductor ecosystems to explore the technologies redefining mobility and manufacturing. From software-defined and self-driving vehicles to electrified mobility\, the event highlights how cutting-edge chip technologies\, smart sensing systems\, and artificial intelligence are powering the next generation of transportation. Through a dynamic lineup of keynotes\, expert presentations\, and panel discussions\, attendees will exchange perspectives on the trends shaping the future—while actively contributing to the conversation. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/semiexpo-heartland-2026/
LOCATION:Detroit Marriott at the Renaissance Center\, Renaissance Center\, 400 Renaissance Dr W\, Detroit\, MI\, 48243\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/03/Logo.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260427
DTEND;VALUE=DATE:20260429
DTSTAMP:20260408T144754Z
CREATED:20260226T175334Z
LAST-MODIFIED:20260408T144754Z
UID:1875-1777248000-1777420799@microsanj.com
SUMMARY:Industry Day and Birck Research Symposium 2026
DESCRIPTION:Microsanj is proud to be a Gold Sponsor for the 2nd annual symposium. We will be exhibiting our latest systems and speaking on our collaborations within the nanotechnology ecosystem. Visit our booth to see our EZ500 live demo\, featuring high-resolution thermal imaging solutions that utilize advanced thermoreflectance and infrared (IR+TR) technology. These innovations are designed to enhance semiconductor testing\, RF analysis\, and materials research. \nOur Co-Founder & CEO\, Mo Shakouri\, will also be presenting: \nMeeting Emerging Thermal Challenges of 3D Heterogeneously Integrated Circuit Packaging Techniques. \n\n4/27\, 10:30 AM – 11:10 AM\nBurton Morgan Center for Entrepreneurship\, MRGN 121\n\nThe Birck Research Symposium is a one-day event showcasing cutting-edge innovation in nanoscience and advanced technology at the Birck Nanotechnology Center at Purdue University. Bringing together researchers\, students\, and industry professionals\, the symposium features research presentations\, keynote talks\, and networking opportunities designed to spark collaboration and highlight breakthrough discoveries. The event takes place at the Hall for Discovery and Learning Research in West Lafayette\, Indiana. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/industry-day-and-birck-research-symposium-2026/
LOCATION:Birck Nanotechnology Center\, 1205 W State St\, West Lafayette\, IN\, 47907
CATEGORIES:Symposium
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260415
DTEND;VALUE=DATE:20260416
DTSTAMP:20260408T174134Z
CREATED:20260323T212216Z
LAST-MODIFIED:20260408T174134Z
UID:1962-1776211200-1776297599@microsanj.com
SUMMARY:Technical Webinar — April 15\, 2026 (Nanosecond & Picosecond Pump-Probe Techniques For Thermal Characterization of Advanced Packages)
DESCRIPTION:Nanosecond and picosecond pump-probe techniques for thermal characterization of advanced packages — real measurement data\, external speakers\, live Q&A.\n\n\n\n\nEvent Details\n\nDate: Wednesday\, April 15\, 2026\nLocation: Virtual\nTime: 7:00 AM – 8:00 AM PDT & 7:00 PM – 8:00 PM PDT\n\n\n\n\nLearn More & Register Now
URL:https://microsanj.com/events/technical-webinar-april-15-2026-optical-sampling-thermoreflectance-for-3d-heterogeneous-integration/
CATEGORIES:Webinar
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/03/Social-Media-Banner-scaled-e1774536739424.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260314
DTEND;VALUE=DATE:20260320
DTSTAMP:20260306T174420Z
CREATED:20260113T222045Z
LAST-MODIFIED:20260306T174420Z
UID:1784-1773446400-1773964799@microsanj.com
SUMMARY:APEX 2026
DESCRIPTION:Microsanj is exhibiting at APEX 2026 in Anaheim\, CA\, at the Anaheim Convention Center\, taking place March 14–19. \n📍 Booth #4203\n🕒 Exhibit Hours \n\nTuesday\, 3/17: 10:00 AM – 6:00 PM\nWednesday\, 3/18: 9:00 AM – 6:00 PM\nThursday\, 3/19: 9:00 AM – 2:00 PM\n\nMicrosanj is a global leader in optical thermal characterization\, delivering 250nm spatial resolution and 500 picosecond transient time resolution for pinpoint accuracy. Our systems empower engineers and researchers to see\, measure\, and understand thermal behavior at submicron scales —driving reliability and innovation in open-circuit failures\, GaN\, RF\, power amplifiers\, material characterization\, and more. Stop by our booth to experience: \n\nLive Demonstrations\nMeet the Microsanj Team\n\nIn addition to our booth\, check out 3 presentations from our Co-Founder & CEO\, Mo Shakouri: \nS5: Metrology Tools and Techniques 1 \n\n3/17\, 10:30 AM – 12:00 PM\nAdvanced Electronic Packaging Conference\, Room 304C\n\nMeeting Emerging Thermal Challenges of 3D Heterogeneously Integrated Circuit Packaging Techniques \n\n3/17\, 2:00 PM – 2:30 PM\nTechnology Pavilion\, Booth 4650\n\nPanel Discussion – Advancements in Metrology Tools and Techniques \n\n3/17\, 4:15 PM – 5:00 PM\nAdvanced Electronic Packaging Conference\, Room 304AB\n\nAPEX EXPO is the premier event in North America for the electronics industry. OEMs\, EMS providers\, PCB manufacturers\, and industry professionals from around the globe come together to access the latest technical content\, contribute to standards development\, and network with the industry’s largest gathering of capital equipment manufacturers\, suppliers\, and product innovators in design\, printed board manufacturing\, electronics assembly\, and test. \nFloorplan \nRegister Now (Use Promo Code 119907 for a free exhibit hall only pass) \nSchedule a meeting with us
URL:https://microsanj.com/events/apex-2026/
LOCATION:Anaheim Convention Center\, 800 W Katella Ave\, Anaheim\, CA\, 92802\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/01/Screenshot-2026-01-29-at-8.25.59-AM.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20260309T183000
DTEND;TZID=UTC:20260309T203000
DTSTAMP:20260226T005221Z
CREATED:20260219T171810Z
LAST-MODIFIED:20260226T005221Z
UID:1846-1773081000-1773088200@microsanj.com
SUMMARY:Microsanj Open House
DESCRIPTION:Join us the evening before our Semi-Therm workshop for an interactive showcase of Microsanj’s transient thermoreflectance systems\, IR/OpenTEST platform demonstrations\, with hands-on stations staffed by Microsanj experts and partner MPI. The Open House includes a special talk by Dr. Ali Shakouri on “Nanoscale Thermal Transport and Characterization for Heterogeneous Integration\,” themed discussion corners on GaN/WBG power\,3DHI packaging\, and RF/mmWave/THz\, and light refreshments. \nRSVP Now
URL:https://microsanj.com/events/microsanj-open-house/
LOCATION:Microsanj Headquarters\, 48421 Milmont Drive\, Fremont\, CA\, 94538\, United States
CATEGORIES:Open House
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260309
DTEND;VALUE=DATE:20260313
DTSTAMP:20260303T185229Z
CREATED:20260113T220037Z
LAST-MODIFIED:20260303T185229Z
UID:1770-1773014400-1773359999@microsanj.com
SUMMARY:GOMACTech 2026
DESCRIPTION:Microsanj is exhibiting at GOMACTech in New Orleans\, LA\, at the Ernest N. Morial Convention Center\, taking place from March 9 to 12. \n📍 Booth #500\n🕒 Exhibit Hours \n\nMarch 10\, 2026 (Tuesday): 12:00 PM to 8:00 PM\nMarch 11\, 2026 (Wednesday): 9:00 AM to 4:00 PM\n\nMicrosanj is excited to exhibit at GOMACTech 2026\, showcasing the latest innovations in thermoreflectance (TR) and infrared (IR) thermal analysis. Visit booth #500 for an exclusive\, hands-on experience with the EZ-THERM showcasing GaN\, designed to deliver real-time temperature mapping and transient thermal analysis—essential for high-performance semiconductor\, RF\, and power electronics applications. Stop by our booth to experience: \n\nLive Demonstrations\nFree Giveaways\nMeet the Microsanj Team\n\nGOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968\, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC\, and provides a forum for government reviews. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/gomactech-2026/
LOCATION:New Orleans Ernest N. Morial Convention Center\, 900 Convention Center Blvd\, New Orleans\, LA\, New Orleans\, CA\, 70130\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/01/2026_Logo-e1769704078938.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260309
DTEND;VALUE=DATE:20260313
DTSTAMP:20260224T225947Z
CREATED:20260113T215402Z
LAST-MODIFIED:20260224T225947Z
UID:1764-1773014400-1773359999@microsanj.com
SUMMARY:Semi-Therm 2026
DESCRIPTION:The SEMI-THERM Symposium is an annual conference dedicated to the thermal management\, design\, and characterization of electronic components and systems. It brings together engineers\, researchers\, and industry professionals to share knowledge\, explore innovations\, and network within the thermal engineering field. The event includes technical presentations\, workshops\, an exhibition showcasing cutting-edge products\, and opportunities for collaboration. \nMicrosanj is excited to announce that we are exhibiting\, presenting\, and having a workshop at Semi-Therm\, taking place in San Jose\, CA. \nVisit us at booth 304 for a live demonstration of the EZ-THERM system\, highlighting open-test & GaN capabilities and the powerful synergy of Infrared (IR) and Thermoreflectance (TR) thermal analysis. \nIn addition to our booth\, check out 3 presentations: \nMicrosanj Exhibitor Workshop \n\n\n\n3/10\, 3:00 PM – 4:45 PM\nFir Room\n\n\n\nTesting & Measurement: Absolute and Relative Temperature Measurements by Transient Gate Resistance Thermometry and Transient Thermoreflectance Imaging \n\n\n\n3/12\, 8:40 AM – 9:00 AM\nOak Room\nGeorges Pavlidis (Professor at University of Connecticut and Microsanj Customer)\n\n\n\nAssorted Topics: Optical Pump Probe Technique with Thermoreflectance Imaging Addresses Thermal Analysis Challenges with Multilayer Structures \n\n\n\n3/12\, 9:20 AM – 9:40 AM\nFir Room\nMo Shakouri (CEO at Microsanj)\n\n\n\nRegister Now \nFloorplan \nSchedule a meeting with us
URL:https://microsanj.com/events/semi-therm-2026/
LOCATION:DoubleTree by Hilton San Jose\, 2050 Gateway Pl\, San Jose\, CA\, 95110\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/avif:https://microsanj.com/wp-content/uploads/2026/01/logo.avif
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260309
DTEND;VALUE=DATE:20260312
DTSTAMP:20260217T193456Z
CREATED:20260113T221607Z
LAST-MODIFIED:20260217T193456Z
UID:1780-1773014400-1773273599@microsanj.com
SUMMARY:GEMIC 2026
DESCRIPTION:Microsanj is pleased to announce that our international representative\, HITECH\, will be serving as a Silver Sponsor at the upcoming GEMIC 2026 conference in Dresden\, Germany. GEMIC (German Microwave Conference) is a premier event that brings together researchers\, industry leaders\, and professionals in the field of microwave and RF technology\, offering a platform for exchanging ideas and showcasing innovative advancements. \nAs a Silver Sponsor\, HITECH will proudly represent Microsanj\, highlighting our state-of-the-art thermal analysis solutions\, including our thermoreflectance technology\, which is transforming thermal management and characterization in high-frequency and high-power applications. \nDon’t miss this opportunity to connect with the HITECH team and explore the future of thermal and device characterization technologies at GEMIC 2026. \nIf you would like to learn more or to register\, you can view the event website.
URL:https://microsanj.com/events/gemic-2026/
LOCATION:AUDIMAX\, Campus South\, Karlsruhe Institute of Technology\, Germany
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/01/Screenshot-2026-01-13-at-2.15.39-PM.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260224
DTEND;VALUE=DATE:20260227
DTSTAMP:20260126T190409Z
CREATED:20260113T214551Z
LAST-MODIFIED:20260126T190409Z
UID:1760-1771891200-1772150399@microsanj.com
SUMMARY:DesignCon 2026
DESCRIPTION:Microsanj is exhibiting at DesignCon in Santa Clara\, CA\, at the Santa Clara Convention Center\, taking place from February 24 to 26. \n📍 Booth #1551\n🕒 Exhibit Hours \n\nWednesday\, February 25\, 2026: 11 a.m.–6 p.m.\nThursday\, February 26\, 2026: 11 a.m.–6 p.m.\n\nMicrosanj is excited to announce that we are exhibiting at Design Con\, taking place at the Santa Clara Convention Center in Santa Clara\, CA. Visit us at booth 1551 to experience a live demonstration of our EZ-THERM system\, showcasing open test and the powerful combination of Infrared (IR) and Thermoreflectance (TR) thermal analysis\, and meet the Microsanj team. \nDesignCon is the premier high-speed communications and system design conference and exposition\, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. \nRegister Now \nUse promo code “INVITE1018447” for a 15% discount on conference packages and/or a FREE expo package \nFloorplan \nSchedule a meeting with us
URL:https://microsanj.com/events/design-con/
LOCATION:Santa Clara Convention Center\, 5001 Great America Pkwy\, Santa Clara\, CA\, 95054\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/01/Screenshot-2026-01-13-at-1.40.42-PM.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260219
DTEND;VALUE=DATE:20260221
DTSTAMP:20260210T153331Z
CREATED:20260113T213458Z
LAST-MODIFIED:20260210T153331Z
UID:1758-1771459200-1771631999@microsanj.com
SUMMARY:Annual HIR Symposium 2026
DESCRIPTION:Microsanj is excited to be a Gold Sponsor at the Annual HIR Symposium! Visit our table for a live demonstration of the EZ-THERM system\, highlighting open-test capabilities and the powerful synergy of Infrared (IR) and Thermoreflectance (TR) thermal analysis. \nMeet the team and see how our products can support your thermal analysis needs. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/annual-hir-symposium/
LOCATION:SEMI Headquarters\, 673 S Milpitas Blvd\, Milpitas\, CA\, 95035\, United States
CATEGORIES:Symposium
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260211
DTEND;VALUE=DATE:20260214
DTSTAMP:20260126T195617Z
CREATED:20260126T194619Z
LAST-MODIFIED:20260126T195617Z
UID:1818-1770768000-1771027199@microsanj.com
SUMMARY:SEMICON Korea 2026
DESCRIPTION:Our Co-Founder and CEO\, Mo Shakouri\, along with our partner MPI and our Korea representatives\, ENSSEL and ROIENTEC CO.\, LTD.\, will be exhibiting SEMICON Korea at the COEX Convention Center in Seoul from February 11–13. \n📍 MPI Booth #W705 \n📍 ENSSEL Booth #G101 \n🕒 Exhibit Hours \n\nFebruary 11\, 2026 | 10:00-17:00 (Last entry 16:30)\nFebruary 12\, 2026 | 10:00-17:00 (Last entry 16:30)\nFebruary 13\, 2026 | 10:00-16:00 (Last entry 15:30)\n\nThermal issues rarely announce themselves—until they become returns\, downtime\, or warranty costs. Microsanj detects submicron hotspots and measures thermal resistance non-destructively\, enabling you to isolate risk early and build confidence in reliability predictions. \nRegister Now \nFloorplan \nSchedule a meeting with us
URL:https://microsanj.com/events/semicon-korea-2026/
LOCATION:COEX Convention & Exhibition Center\, 513 Yeongdong-daero\, Seoul\, Korea\, Democratic People's Republic of
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/01/logo.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260118
DTEND;VALUE=DATE:20260122
DTSTAMP:20260113T221716Z
CREATED:20251218T204639Z
LAST-MODIFIED:20260113T221716Z
UID:1748-1768694400-1769039999@microsanj.com
SUMMARY:RWW 2026
DESCRIPTION:Microsanj is starting the year strong by exhibiting at Radio Wireless Week (RWW) in Los Angeles / Hollywood at the Loews Hollywood Hotel\, taking place January 19–20. \n📍 Booth #103\n🕒 Exhibit Hours \n\nMonday\, 1/19: 1:00 PM – 7:00 PM\nTuesday\, 1/20: 9:00 AM – 5:00 PM\n\nMicrosanj is a global leader in optical thermal characterization\, delivering 250nm spatial resolution and 500 picosecond transient time resolution for pinpoint accuracy. Our systems empower engineers and researchers to see\, measure\, and understand thermal behavior at submicron scales —driving reliability and innovation in open-circuit failures\, GaN\, RF\, power amplifiers\, material characterization\, and more. Stop by our booth to experience: \n\nLive Demonstrations\nFree Giveaways\nMeet the Microsanj Team\n\nRadio Wireless Week is a premier event for the RF and wireless community\, bringing together engineers\, researchers\, and industry leaders to explore the latest advancements in RF technologies. We look forward to connecting with you in Hollywood! \nRegister Now \nSCHEDULE A MEETING WITH US
URL:https://microsanj.com/events/rww-2026/
LOCATION:Lowes Hollywood Hotel\, 1755 Highland Ave\, Los Angeles\, CA\, 90028\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2025/12/RWW-logo-e1766090833951.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251214
DTEND;VALUE=DATE:20251219
DTSTAMP:20251111T163925Z
CREATED:20251111T160817Z
LAST-MODIFIED:20251111T163925Z
UID:1723-1765670400-1766102399@microsanj.com
SUMMARY:IEEE MAPCON 2025
DESCRIPTION:IEEE Microwaves\, Antennas and Propagation Conference (IEEE MAPCON 2025) will be held at Lulu International Convention Centre\, Grand Hyatt Bolgatty\, Kochi (India) from December 14 – 18\, 2025. MAPCON 2025 will offer a comprehensive international platform for the symbiotic sharing of cutting-edge research and technologies in the fields of electromagnetics\, microwave engineering\, and antenna and propagation. The event will bring together leading researchers\, engineers\, technocrats\, and practitioners from around the world to share their knowledge and expertise. \nWe’re pleased to share that our India representatives\, Jyoti Electronics & Step Electronics Pvt. Ltd\, will be attending MAPCON 2025\, a leading conference focused on electromagnetics\, microwave engineering\, and antenna and propagation. This participation reinforces our growing presence in India’s rapidly expanding semiconductor ecosystem.
URL:https://microsanj.com/events/ieee-mapcon-2025/
LOCATION:Lulu Bolgatty International Convention Center (LBICC)\, Bolgatty Island\, adjacent to Grand Hyatt\, Bolgatty\, Kochi\, 682504\, India
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2025/11/2025_logo_01.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251202
DTEND;VALUE=DATE:20251206
DTSTAMP:20251124T210045Z
CREATED:20250821T144545Z
LAST-MODIFIED:20251124T210045Z
UID:1582-1764633600-1764979199@microsanj.com
SUMMARY:EPTC 2025
DESCRIPTION:The IEEE Electronics Packaging Technology Conference (EPTC)\, the flagship IEEE EPS conference in the Asia-Pacific region\, will be held in Singapore. Microsanj is proud to be a Bronze Sponsor of this highly respected global event. \nAli Shakouri\, Ph.D.\, will present two presentations: \n\nOverview of 3D Heterogeneously Integrated Circuit Packaging Characterization Techniques on 12/3 at 8:30 AM – 10:00 AM\nThermal Characterization and AI Analytics for 3D Heterogeneous Integrated Circuits on 12/5 at 11:00 AM – 11:30 AM\n\nRegister Now
URL:https://microsanj.com/events/eptc-2025/
LOCATION:Resorts World Sentosa\, 8 Sentosa Gateway\, Singapore
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/jpeg:https://microsanj.com/wp-content/uploads/2025/08/a5281745766564.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251120
DTEND;VALUE=DATE:20251122
DTSTAMP:20251028T145435Z
CREATED:20251028T145355Z
LAST-MODIFIED:20251028T145435Z
UID:1682-1763596800-1763769599@microsanj.com
SUMMARY:IEEE REPP Symposium 2025
DESCRIPTION:The 2025 IEEE REPP is a two-day technical event focused on Reliability for Electronics and Photonics Packaging and is taking place at the SEMI Headquarters in Milpitas\, CA! \nMicrosanj is excited to announce that we are a silver sponsor for this event\, and our very own Dustin Kendig will be presenting “Thermal Analysis Techniques to Address the Growing Thermal Challenges with Heterogeneous Packaging” on 11/21 at 1:45 PM.
URL:https://microsanj.com/events/ieee-repp-symposium-2025/
LOCATION:SEMI Headquarters\, 673 S Milpitas Blvd\, Milpitas\, CA\, 95035\, United States
CATEGORIES:Symposium
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2025/10/Screenshot-2025-10-28-at-7.50.11-AM.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251116
DTEND;VALUE=DATE:20251121
DTSTAMP:20251028T145506Z
CREATED:20250407T172334Z
LAST-MODIFIED:20251028T145506Z
UID:1391-1763251200-1763683199@microsanj.com
SUMMARY:ISTFA 2025
DESCRIPTION:Microsanj will join the 51st International Symposium for Testing and Failure Analysis (ISTFA) in Pasadena\, CA. As the premier event for the microelectronics failure analysis community\, ISTFA offers a platform for innovation and collaboration. \nVisit Microsanj at Booth #714 to experience a live demonstration of our EZ-THERM system\, showcasing open test and the powerful combination of Infrared (IR) and Thermoreflectance (TR) thermal analysis. Discover how our advanced tools provide precise\, non-invasive thermal characterization for today’s high-performance devices. Please speak with our experts to discuss how Microsanj solutions can support your specific research and reliability needs. \nView Floorplan
URL:https://microsanj.com/events/istfa-2025/
LOCATION:Pasadena Convention Center\, 300 E Green St\, Pasadena\, CA\, 91101\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2025/04/ISTFA-Logo.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251104
DTEND;VALUE=DATE:20251106
DTSTAMP:20251006T205458Z
CREATED:20250825T154306Z
LAST-MODIFIED:20251006T205458Z
UID:1588-1762214400-1762387199@microsanj.com
SUMMARY:PIC Summit Europe
DESCRIPTION:The photonic chip industry is reaching new heights – but scaling production\, applications\, and investments requires a united effort. As demand surges for high-speed\, energy-efficient solutions\, the question isn’t if photonic chips will revolutionise industries\, but how fast we can make it happen.  \nAt PIC Summit Europe 2025\, we bring together an entire ecosystem of designers\, foundries\, integrators\, OEMs\, investors\, and thought leaders to tackle the industry’s biggest challenges and opportunities. From advancing manufacturing capacity to expanding market applications and securing funding for growth\, this event is where the photonic chip industry aligns its vision for the future. \nMicrosanj is proud to sponsor our partner CN Rood at this event\, where they will showcase Microsanj’s advanced thermal imaging and analysis solutions for photonic and semiconductor device research. Attendees can explore how Microsanj’s high-resolution\, non-contact thermoreflectance systems deliver precise thermal characterization—critical for optimizing the performance and reliability of photonic chips and integrated devices.
URL:https://microsanj.com/events/pic-summit-europe/
LOCATION:Evoluon\, Noord Brabantlaan 1A 5652\, LA Eindhoven\, Netherlands
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2025/08/Main_PS_logo_dark_background_600px.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251028
DTEND;VALUE=DATE:20251031
DTSTAMP:20251006T205448Z
CREATED:20250407T172931Z
LAST-MODIFIED:20251006T205448Z
UID:1394-1761609600-1761868799@microsanj.com
SUMMARY:InterPACK 2025
DESCRIPTION:As a Silver Sponsor of InterPACK\, the premier international conference on electronics packaging and heterogeneous integration\, Microsanj will showcase live demonstrations of its POSH-TDTR platform and GaN thermal analysis solutions. \nConference attendees can experience firsthand how Microsanj’s tools deliver high-resolution insights for addressing device and packaging-level thermal challenges. \nRegister Now
URL:https://microsanj.com/events/interpack-2025/
LOCATION:Hotel FERA Anaheim\, a DoubleTree by Hilton\, 100 The City Dr S\, Orange\, CA\, 92868\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2025/04/InterPACK-Logo.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251021
DTEND;VALUE=DATE:20251025
DTSTAMP:20251013T145016Z
CREATED:20250711T184812Z
LAST-MODIFIED:20251013T145016Z
UID:1504-1761004800-1761350399@microsanj.com
SUMMARY:IMPACT 2025
DESCRIPTION:IMPACT 2025 adopts the theme “Energy-Efficient AI: From Cloud to Edge\,” reflecting the industry’s increasing focus on high-performance\, low-power solutions. As AI applications continue to expand—from data centers to edge devices—the need for advanced PCB\, IC substrates\, heterogeneous integration\, and packaging technologies has become increasingly critical. \nPresentation AnnouncementSpeaker: Andrew TaySession: S15 – Power ElectronicsDate & Time: Wednesday\, October 22 | 10:10–10:40 AMTitle: Thermal and Failure Analysis of Advanced Microelectronic Devices \nOur rep\, Andrew Tay\, will explore advanced thermal analysis techniques for today’s high-power\, miniaturized devices. His talk highlights how thermoreflectance thermography enables sub-micron\, picosecond-resolution mapping to reveal hotspots and characterize thermal behavior non-destructively. He will also present a novel method using quantum spin crossover (SCO) materials to correlate electromagnetic power with temperature—offering a faster\, cost-effective approach for antenna field analysis—supported by real-world case studies.
URL:https://microsanj.com/events/impact-2025/
LOCATION:Private: 5F Taipei Nangang Exhibition Center (Hall 1)\, No.1\, Jingmao 2nd Rd.\, Nangang District\, Taipei City\, 11568\, Taiwan
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2025/07/logo.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251014
DTEND;VALUE=DATE:20251017
DTSTAMP:20251006T205317Z
CREATED:20250711T175648Z
LAST-MODIFIED:20251006T205317Z
UID:1490-1760400000-1760659199@microsanj.com
SUMMARY:IEEE PAINE 2025
DESCRIPTION:The IEEE PAINE Conference brings together researchers and practitioners from academia\, industry\, and government to address advances in hardware security\, inspection\, and supply chain assurance of electronics. \nAs a Platinum Sponsor\, Microsanj will host a booth highlighting its newly released POSH-TDTR ultrafast thermoreflectance system\, designed for advanced thermal characterization. \nIn addition\, Mo Shakouri\, Ph.D.\, Founder & CEO of Microsanj\, will deliver the talk:\n“Buried Truths: Limitations and Opportunities in Non-Invasive Thermal Analysis for 2.5D/3D ICs” — offering insights into the opportunities and challenges of optical thermal analysis for reliability assurance and failure analysis of advanced integrated circuits. \n“IEEE PAINE brings together metrologists\, security researchers\, and test houses to explore the latest industry trends. We’re thrilled to have Microsanj showcase their exciting work with our community.”\n— Navid Asadi\, Associate Professor\, Electrical and Computer Engineering\, University of Florida (affiliated with the Materials Science and Engineering Department) \nRegister Now
URL:https://microsanj.com/events/ieee-paine-2025/
LOCATION:Denver Marriott Westminster\, 7000 Church Ranch Boulevard\, Westminster\, CO\, 80021\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/jpeg:https://microsanj.com/wp-content/uploads/2025/07/PAINElogo.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20250921
DTEND;VALUE=DATE:20250927
DTSTAMP:20250903T145639Z
CREATED:20250207T222549Z
LAST-MODIFIED:20250903T145639Z
UID:296-1758412800-1758931199@microsanj.com
SUMMARY:EuMW 2025
DESCRIPTION:European Microwave Week (EuMW) 2025 is Europe’s premier event dedicated to microwave\, RF\, wireless\, and radar technologies. EuMW 2025 will feature three cutting-edge conferences\, industry-led workshops\, and a world-class exhibition showcasing the latest innovations in microwave and wireless engineering. The event brings together academics\, researchers\, and industry professionals to explore advancements in 5G/6G\, automotive radar\, IoT\, aerospace\, and defense applications\, fostering collaboration and technological progress in the field. Microsanj will be exhibiting in Booth A140 and also with our partner\, MPI Corporation\, at Booth E046. \n👉 Stay tuned for a big announcement from Microsanj during EuMW 2025! \nRegister Now \nView Floorplan \n📡 6G Forum\nDate & Time: Monday\, September 22 | 9:00 AM – 8:00 PM \nDemo: RF Power + Loss MappingEZ-THERM System: Visualizing RF Power Dissipation & EM Field Distribution \nWhat You’ll See:Using the EZ-THERM system\, we’ll visualize thermal patterns caused by current density and RF power dissipation on active transmission lines and RF components. You’ll observe how mismatches\, losses\, and radiation effects generate localized hot spots\, highlighting areas of inefficiency or potential failure. \nWhy It Matters:Thermal signatures provide insight into the electric field distribution and energy losses across your RF layout. This demo helps engineers correlate thermal and electrical behavior—essential for identifying design flaws\, verifying simulations\, and optimizing system reliability and performance. \nApplications: \n\n5G/6G RF Module & MMIC Testing\nSemiconductor Device Analysis\nPower Electronics Thermal Analysis\n\n\n🔬 Microsanj Booth (A140)\nExhibition Opening Times: \n\nTuesday\, September 23: 9:30 AM – 6:00 PM\nWednesday\, September 24: 9:30 AM – 5:30 PM\nThursday\, September 25: 9:30 AM – 4:30 PM\n\n🔧 Demo 1: High-Speed + High-Power GaN\nEZ-THERM System Thermal Imaging \nWhat You’ll See:Watch the EZ500 in action as it captures live thermal behavior of a GaN device using our high-resolution\, motorized probe station. Experience real-time\, picosecond-level thermal imaging that reveals rapid junction temperature spikes and elusive hot spots invisible to traditional tools. \nWhy It Matters:This is next-gen thermal analysis—ideal for engineers pushing GaN devices to their limits. With 250 nm spatial resolution and 500 ps temporal resolution\, it uncovers hidden hot spots and rapid thermal events that traditional tools simply miss. \nApplications: \n\nGaN Power Amplifier Testing\nHigh-Frequency Device Characterization\nTIM and Thermal Path Evaluation\nFailure Analysis & Process Integrity\nElectro-Thermal Modeling Support\n\n🌡️ Demo 2: EZ-THERM Discovery Zone\nHands-On Open Platform for Real-Time Thermal Analysis \nWhat You’ll See:Interact directly with our EZ-THERM system on a CPS probe station. Test various materials\, devices\, and layouts with instant thermal feedback—no specialized setup needed. Features Lock-In\, Flash Thermography\, and Open Circuit Detection. \nWhy It Matters:This is a fast\, flexible tool for researchers\, prototypers\, and product developers. Measure thermal maps of full PCBs or zoom down to 4.8 μm resolution—all in under a minute. \nApplications: \n\nMaterials & Prototyping Research\nThermal Characterization of Complex Layouts\nPCB and Chip-Level Analysis\nMEMS and Power IC Testing\n\n📡 Demo 3: RF Power + Loss Mapping\nEZ-THERM System: Visualizing RF Power Dissipation & EM Field Distribution \nWhat You’ll See:Using the EZ-THERM system\, we’ll visualize thermal patterns caused by current density and RF power dissipation on active transmission lines and RF components. You’ll observe how mismatches\, losses\, and radiation effects generate localized hot spots\, highlighting areas of inefficiency or potential failure. \nWhy It Matters:Thermal signatures provide insight into the electric field distribution and energy losses across your RF layout. This demo helps engineers correlate thermal and electrical behavior—essential for identifying design flaws\, verifying simulations\, and optimizing system reliability and performance. \nApplications: \n\n5G/6G RF Module & MMIC Testing\nSemiconductor Device Analysis\nPower Electronics Thermal Analysis\n\n\n🤝 MPI + Microsanj Joint Demo (E046)\nExhibition Opening Times: \n\nTuesday\, September 23: 9:30 AM – 6:00 PM\nWednesday\, September 24: 9:30 AM – 5:30 PM\nThursday\, September 25: 9:30 AM – 4:30 PM\n\n📡 Demo 4: MPI Automated Probe + Microsanj Thermal Imaging\nWhat You’ll See:Experience an automated MPI probe station integrated with the Microsanj thermal microscope\, enabling advanced thermal imaging for devices operating up to 250 GHz. Watch as high-speed\, high-resolution analysis reveals hidden hot spots and thermal dynamics during active device operation. \nWhy It Matters:This powerful combination delivers next-level insight for engineers working with cutting-edge RF and mmWave devices. With sub-micron spatial resolution and picosecond-level temporal response\, it provides unmatched visibility into thermal behavior at extreme frequencies. \nApplications: \n\n5G/6G and mmWave Device Characterization\nHigh-Frequency GaN and GaAs Testing\nReliability and Lifetime Prediction\nAdvanced RF Module Development\nElectro-Thermal Modeling & Validation
URL:https://microsanj.com/events/eumw-2025/
LOCATION:Jaarbeurs Convention Centre\, Jaarbeursplein 6\, 3521 AL\, Utrecht\, Netherlands
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2025/02/EuMW-e1738967125985.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20250904
DTEND;VALUE=DATE:20250906
DTSTAMP:20250812T181311Z
CREATED:20250812T181311Z
LAST-MODIFIED:20250812T181311Z
UID:1554-1756944000-1757116799@microsanj.com
SUMMARY:Chitose International Forum on Science & Technology 2025
DESCRIPTION:The 25th Chitose International Forum on Science & Technology (CIF25) will be held at Chitose Institute of Science and Technology (CIST)\, Hokkaido\, Japan. CIF25 has many scopes in the wide fields of science and technology\, including applied chemistry\, biology and environmental science\, information and communication technology\, and computer science. This forum will feature world-class keynote speakers\, invited speakers\, and regular sessions composed of on-site or online oral presentations. \nWe will be presenting a “Meeting the Emerging Thermal Challenges of 3D Heterogeneously Integrated Circuit Packaging Techniques.” Check back here for more details! \n 
URL:https://microsanj.com/events/chitose-international-forum-on-science-technology-2025/
LOCATION:Chitose Institute of Science and Technology\, 758-65 Bibi\, Chitose\, Hokkaido\, 066-0012\, Japan
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2025/08/CIFlogo.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20250805
DTEND;VALUE=DATE:20250808
DTSTAMP:20250714T175333Z
CREATED:20250711T184140Z
LAST-MODIFIED:20250714T175333Z
UID:1496-1754352000-1754611199@microsanj.com
SUMMARY:ICEPT 2025
DESCRIPTION:The International Conference on Electronic Packaging Technology (ICEPT) is one of the largest and most cohesive packaging technology conferences in Asia. ICEPT 2025 will be held by Shanghai University\, IEEE Electronics Packaging Society (IEEE-EPS)\, and Electronic Manufacturing & Packaging Technology Society of the Chinese Institute of Electronics (CIE-EMPT). \nWe’re excited to announce that Dr Andrew Tay\, our international representative\, will present an Invited Talk titled “Thermal and Failure Analysis of Advanced Microelectronic Devices” at ICEPT 2025 on August 7. \nDrawing from over 35 years of experience\, Andrew will cover real-world case studies in thermal and failure analysis of advanced microelectronic devices.
URL:https://microsanj.com/events/icept-2025-26th-international-conference-on-electronic-packaging-technology/
LOCATION:Sheraton Shanghai Jiading Hotel\, 66 Jiatang Hwy\, Jiading District\, Shanghai\, 201800\, China
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/jpeg:https://microsanj.com/wp-content/uploads/2025/07/logo.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20250804
DTEND;VALUE=DATE:20250808
DTSTAMP:20250711T184219Z
CREATED:20250711T175026Z
LAST-MODIFIED:20250711T184219Z
UID:1484-1754265600-1754611199@microsanj.com
SUMMARY:TFAWS 2025
DESCRIPTION:The Thermal and Fluids Analysis Workshop (TFAWS) is an annual training and professional development workshop that is designed to encourage knowledge sharing\, professional development\, and networking throughout the thermal and fluids engineering community within NASA and the aerospace community at large. The vision of TFAWS is to maintain continuity over time and between disciplines throughout the thermal and fluids engineering community. \nMicrosanj is pleased to announce that we will be exhibiting and hosting a demo session at TFAWS 2025 in San Jose\, CA! Check back here for more details!
URL:https://microsanj.com/events/tfaws-2025-thermal-fluids-analysis-workshop/
LOCATION:Diaz Compean Student Union\, One Washington Sq\, San Jose\, CA\, 95192\, United States
CATEGORIES:Workshop
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2025/07/Screenshot-2025-07-11-at-10.47.56 AM.png
END:VEVENT
END:VCALENDAR