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BEGIN:VEVENT
DTSTART;VALUE=DATE:20260427
DTEND;VALUE=DATE:20260429
DTSTAMP:20260408T144754Z
CREATED:20260226T175334Z
LAST-MODIFIED:20260408T144754Z
UID:1875-1777248000-1777420799@microsanj.com
SUMMARY:Industry Day and Birck Research Symposium 2026
DESCRIPTION:Microsanj is proud to be a Gold Sponsor for the 2nd annual symposium. We will be exhibiting our latest systems and speaking on our collaborations within the nanotechnology ecosystem. Visit our booth to see our EZ500 live demo\, featuring high-resolution thermal imaging solutions that utilize advanced thermoreflectance and infrared (IR+TR) technology. These innovations are designed to enhance semiconductor testing\, RF analysis\, and materials research. \nOur Co-Founder & CEO\, Mo Shakouri\, will also be presenting: \nMeeting Emerging Thermal Challenges of 3D Heterogeneously Integrated Circuit Packaging Techniques. \n\n4/27\, 10:30 AM – 11:10 AM\nBurton Morgan Center for Entrepreneurship\, MRGN 121\n\nThe Birck Research Symposium is a one-day event showcasing cutting-edge innovation in nanoscience and advanced technology at the Birck Nanotechnology Center at Purdue University. Bringing together researchers\, students\, and industry professionals\, the symposium features research presentations\, keynote talks\, and networking opportunities designed to spark collaboration and highlight breakthrough discoveries. The event takes place at the Hall for Discovery and Learning Research in West Lafayette\, Indiana. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/industry-day-and-birck-research-symposium-2026/
LOCATION:Birck Nanotechnology Center\, 1205 W State St\, West Lafayette\, IN\, 47907
CATEGORIES:Symposium
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260429
DTEND;VALUE=DATE:20260501
DTSTAMP:20260311T165238Z
CREATED:20260311T165006Z
LAST-MODIFIED:20260311T165238Z
UID:1905-1777420800-1777593599@microsanj.com
SUMMARY:SEMIEXPO Heartland 2026
DESCRIPTION:Dr. Mo Shakouri will be a part of Session 3: Thermal Management & Power Delivery in Advanced Packaging: From TIMs to Warpage Control by presenting Meeting Emerging Thermal Challenges of 3D Heterogeneously Integrated Circuit Packaging Techniques on Thursday\, April 30\, from 10:05 AM – 10:25 AM. \nSEMIEXPO Heartland 2026 brings together the automotive and semiconductor ecosystems to explore the technologies redefining mobility and manufacturing. From software-defined and self-driving vehicles to electrified mobility\, the event highlights how cutting-edge chip technologies\, smart sensing systems\, and artificial intelligence are powering the next generation of transportation. Through a dynamic lineup of keynotes\, expert presentations\, and panel discussions\, attendees will exchange perspectives on the trends shaping the future—while actively contributing to the conversation. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/semiexpo-heartland-2026/
LOCATION:Detroit Marriott at the Renaissance Center\, Renaissance Center\, 400 Renaissance Dr W\, Detroit\, MI\, 48243\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/03/Logo.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260518
DTEND;VALUE=DATE:20260522
DTSTAMP:20260427T174659Z
CREATED:20260226T175923Z
LAST-MODIFIED:20260427T174659Z
UID:1881-1779062400-1779407999@microsanj.com
SUMMARY:CS Mantech 2026 - International Conference on Compound Semiconductor Manufacturing Technology
DESCRIPTION:Microsanj will be exhibiting at Booth #213 for a live demo showcasing GaN thermal imaging with our EZ THERM system. It’s the perfect opportunity to see the technology in action and meet the team. We’d love to chat about how our solutions can support your work. \nExhibit Hours: \n\nTuesday\, May 19th (7:00 AM – 5:00 PM)\nWednesday\, May 20th (7:00 AM – 1:30 PM)\n\nMicrosanj will also be presenting at the exhibits forum on Tuesday\, May 19th\, happening from 5:00 PM – 6:00 PM at Salons A – D (Lower Level I). \nCS MANTECH is a not-for-profit organization whose focus is to provide a forum for members of the compound semiconductor community to exchange and discuss new ideas to better serve the public in general. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/cs-mantech-2026-international-conference-on-compound-semiconductor-manufacturing-technology/
LOCATION:Portland Marriott Downtown Waterfront\, 1401 SW Naito Pkwy\, Portland\, OR\, 97201\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/02/cs-mantech-logo-e1772223404979.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260522
DTEND;VALUE=DATE:20260523
DTSTAMP:20260501T162853Z
CREATED:20260501T162336Z
LAST-MODIFIED:20260501T162853Z
UID:2103-1779408000-1779494399@microsanj.com
SUMMARY:Benelux Heterogeneous Integration Conference 2026
DESCRIPTION:Our international representative\, CNROOD\, has taken on the role of a Bronze Sponsor at the Benelux Heterogeneous Integration Conference 2026. This premier event is an exhibition and conference on advanced semiconductor systems development in the Low Countries\, bringing together the semiconductor\, optical communication\, photonics\, and equipment communities\, focusing on advanced packaging \nAs part of their sponsorship\, CNROOD will proudly represent Microsanj at the conference\, showcasing our cutting-edge solutions and expertise. We invite attendees to connect with the CNROOD team to learn more about our innovative thermal analysis tools and their applications in RF and microwave technologies. \nIf you would like to learn more or to register\, you can view the event website.
URL:https://microsanj.com/events/benelux-heterogeneous-integration-conference-2026/
LOCATION:Mikrocentrum\, De Run 1115\, 5503 LB De Run 1115\, 5503 LB\, Veldhoven\, Netherlands
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/05/BHIC-logo-L-e1777652611938.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260526
DTEND;VALUE=DATE:20260530
DTSTAMP:20260427T175040Z
CREATED:20260323T152549Z
LAST-MODIFIED:20260427T175040Z
UID:1952-1779753600-1780099199@microsanj.com
SUMMARY:ITherm 2026
DESCRIPTION:We’re pleased to announce that we are gold sponsors. Come visit us on the exhibit floor for a demo\, and don’t miss our sponsored presentation on Friday\, May 29\, from 11:30–11:45 AM in Room 3. \nITherm 2026 will be held alongside the 76th Electronic Components and Technology Conference (ECTC 2026 – http://www.ectc.net)\, a premier electronics packaging conference\, at the JW Marriott Orlando\, Grande Lakes\, Orlando\, Florida\, USA. Joint registrations will be available at a discounted rate. In addition to paper presentations and vendor exhibits\, ITherm 2026 will include panel discussions\, keynote lectures by prominent speakers\, invited technology talks\, ECTC/ITherm joint networking events and short courses\, and a student design competition. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/itherm-2026/
LOCATION:JW Marriott Orlando\, Grande Lakes\, 4040 Central Florida Parkway\, Orlando\, FL\, 32837\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/03/Screenshot-2026-03-23-at-8.22.18-AM-e1774279583707.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260526
DTEND;VALUE=DATE:20260530
DTSTAMP:20260420T210814Z
CREATED:20260323T153141Z
LAST-MODIFIED:20260420T210814Z
UID:1956-1779753600-1780099199@microsanj.com
SUMMARY:ECTC 2026
DESCRIPTION:The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging\, components\, and microelectronic systems science\, technology\, and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT). \nWe’re proud to announce our sponsorship of the 2026 IEEE EPS Heterogeneous Integration Roadmap (HIR) Workshop at ECTC in Orlando\, FL. \nThis full-day workshop on Tuesday\, May 26 brings together leaders in advanced packaging to discuss the technologies shaping our industry’s future. The day features four technical sessions covering topics including Additive Electronics Manufacturing (AME) for Advanced Packaging and CHIPS R&D Metrology\, chaired by Ravi Mahajan of Intel Corporation and William Chen of ASE. \nAs thermal imaging plays an increasingly critical role in heterogeneous integration and advanced packaging\, Microsanj is honored to support the important work happening in this space. \nRegister Now \nSchedule a meeting with us \n 
URL:https://microsanj.com/events/ectc-2026/
LOCATION:JW Marriott Orlando\, Grande Lakes\, 4040 Central Florida Parkway\, Orlando\, FL\, 32837\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/03/ectclogo-circle-2026-year-e1774279917900.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260527
DTEND;VALUE=DATE:20260528
DTSTAMP:20260514T141831Z
CREATED:20260429T201814Z
LAST-MODIFIED:20260514T141831Z
UID:2097-1779840000-1779926399@microsanj.com
SUMMARY:Multiphysics Characterization of GaN and Wide‑Bandgap RF Devices: Correlating Pulsed‑IV\, RF\, and Thermoreflectance Thermal Imaging Measurements (Technical Webinar)
DESCRIPTION:Exploring how multiphysics approaches are unlocking new understanding of GaN\, SiC\, and next-generation semiconductor devices. \n\n\n\n\nEvent Details\n\nDate: Wednesday\, May 27\, 2026\nLocation: Virtual\nTime: 7:00 AM – 8:00 AM PDT & 7:00 PM – 8:00 PM PDT\n\n\n\n\nLearn More & Register Now
URL:https://microsanj.com/events/technical-webinar-may-27-2026-multiphysics-characterization-of-gan-and-wide-bandgap-rf-devices-correlating-pulsed-iv-rf-and-thermoreflectance-thermal-imaging-measurement/
LOCATION:Virtual
CATEGORIES:Webinar
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/04/Webinar-Social-Media-Image-e1777493935499.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260527
DTEND;VALUE=DATE:20260528
DTSTAMP:20260501T162834Z
CREATED:20260501T162718Z
LAST-MODIFIED:20260501T162834Z
UID:2111-1779840000-1779926399@microsanj.com
SUMMARY:Benelux RF&IC Conference 2026
DESCRIPTION:Our international representative\, CNROOD\, has taken on the role of a Gold Sponsor at the Benelux RF & IC Conference 2026. This premier event is an exhibition and conference on advanced chip development in the Low Countries\, bringing together the RF\, analog & mixed-signal\, and digital communities \nAs part of their sponsorship\, CNROOD will proudly represent Microsanj at the conference\, showcasing our cutting-edge solutions and expertise. We invite attendees to connect with the CNROOD team to learn more about our innovative thermal analysis tools and their applications in RF and microwave technologies. \nIf you would like to learn more or to register\, you can view the event website.
URL:https://microsanj.com/events/benelux-rfic-conference-2026/
LOCATION:Mikrocentrum\, De Run 1115\, 5503 LB De Run 1115\, 5503 LB\, Veldhoven\, Netherlands
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/05/Benelux-RFIC-2026-logo-rgb-150-e1777652833318.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260607
DTEND;VALUE=DATE:20260613
DTSTAMP:20260507T190933Z
CREATED:20260227T200144Z
LAST-MODIFIED:20260507T190933Z
UID:1886-1780790400-1781308799@microsanj.com
SUMMARY:IMS 2026
DESCRIPTION:The IEEE International MTT Symposia (IMS) is the world’s premier RF and microwave technical conference and industry exhibition. Thousands of industry professionals from around the world gather here to connect\, see the latest technology advancements\, and discover cutting-edge theories\, tools\, and techniques. \n\n\n\nMicrosanj will exhibit\, present\, and host a workshop at IMS 2026 in Boston\, MA! Visit us at Booth 12027 to experience live demonstrations\, speak with Microsanj experts about your thermal challenges and how our tools can help optimize your designs\, and receive exclusive giveaways. \n🗓 EXHIBIT HALL HOURS \n\nTuesday\, June 9: 9:30 AM – 5:00 PM\nWednesday\, June 10: 9:30 AM – 6:00 PM\nThursday\, June 11: 9:30 AM – 3:00 PM\n\n\n\nView Floorplan \nRegister \n\n🎤 Microapps Presentation\nAdvances In Thermal Analysis to Address the Growing Thermal Challenges of 3D Heterogeneous Integration📅 6/9/2026🕗 3:42 PM – 3:57 PM📍 MicroApps Theater (Booth 15122) \n\n🎤 Advanced Thermal Management in RF Systems: From Wide-Bandgap Materials to Industrial Implementation Workshop \n📅  6/8/26🕗 8:00 AM – 11:50 AM📍 Room 157C \nJoin us at IMS 2026 for Advanced Thermal Management in RF Systems: From Wide-Bandgap Materials to Industrial Implementation—a must-attend workshop exploring the future of thermal design in high-power RF and microwave applications. This expert-led program brings together leading voices from Stanford University\, University of Connecticut\, GlobalFoundries\, Université Catholique de Louvain\, DARPA\, and Microsanj LLC. Sessions span wide-bandgap materials\, transient thermal dynamics\, advanced modeling\, self-heating mitigation\, and cutting-edge thermoreflectance imaging—culminating in a holistic\, system-level approach to thermal-electromagnetic co-design. Don’t miss this opportunity to learn from top researchers and industry innovators shaping the next decade of RF thermal management. \n\nSpeakers: \n\nProf. Srabanti Chowdhury – Stanford University\nProf Georges Pavlidis – University of Connecticut\nOscar D. Restrepo – Global Foundries\nProf. Jean-Pierre Raskin – Université Catholique de Louvain (Presented by Martin Vanbrabant)\nYogendra Joshi- DARPA\nMo Shakouri – Microsanj LLC
URL:https://microsanj.com/events/ims-2026/
LOCATION:Thomas M. Menino Convention & Exhibition Center (MCEC)\, 415 Summer St\, Boston\, MA\, 02210\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/02/IMS2026-logo-RGB_Badge-e1772222568995.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260707
DTEND;VALUE=DATE:20260708
DTSTAMP:20260622T163642Z
CREATED:20260615T181804Z
LAST-MODIFIED:20260622T163642Z
UID:2295-1783382400-1783468799@microsanj.com
SUMMARY:ThermCon 2026
DESCRIPTION:Microsanj is excited to announce that our Co-Founder  & CEO\, Dr. Mo Shakouri\, will be speaking at the ThermCon 2026 in Santa Clara\, CA. Here are his presentation details: \n\nDate: 7/7/26\nTime: 4:30 – 4:55 PM\nPresentation: Wide dynamic range laser heating thermoreflectance characterization of multi-layer films and 3D integrated circuits.\n\nThermal management is becoming a very important area for semiconductor packaging\, and there are many new developments in semiconductor design (chip and package)\, thermal interface materials\, various cooling technologies (heat spreader\, heat sink\, vapor chamber\, immersive cooling\, cold plate\, 2-phase cooling\, microchannels\, etc.)\, testing\, measurement and characterization\, modeling and simulation\, etc. This conference will bring together participants from around the world\, from academia\, research institutions\, and industry (fabless\, IDM\, OSAT\, materials\, cooling modules\, etc.)\, into a conference for a focused exchange and in-depth interactions. \nLearn More
URL:https://microsanj.com/events/thermcon-2026/
LOCATION:Hyatt Regency Santa Clara\, 5101 Great America Pkwy\, Santa Clara\, CA\, 95054\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/06/Screenshot-2026-06-15-at-11.17.35-AM.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260802
DTEND;VALUE=DATE:20260808
DTSTAMP:20260727T154336Z
CREATED:20260615T182150Z
LAST-MODIFIED:20260727T154336Z
UID:2299-1785628800-1786147199@microsanj.com
SUMMARY:IWGO 2026
DESCRIPTION:Microsanj is proud to announce that we are gold sponsors for the International Workshop on Gallium Oxide and Related Materials (IWGO-6)\, which is the most prestigious international forum for Ga2O3 and related materials. The sixth workshop is scheduled for August 2-7\, 2026\, in College Park\, Maryland. \nExhibit Hours: \n\nMonday: 9:00 a.m.-5:30 p.m.\nTuesday-Thursday: 8:30 a.m.-5:30 p.m.\nFriday: 8:30 a.m.-11:00 a.m.\n\nLearn More
URL:https://microsanj.com/events/iwgo-2026/
LOCATION:Edward St. John Learning & Teaching Center\, 4131 Campus Drive\, College Park\, MD\, 20742\, United States
CATEGORIES:Workshop
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/06/Screenshot-2026-06-15-at-11.21.28-AM.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260826
DTEND;VALUE=DATE:20260829
DTSTAMP:20260814T160626Z
CREATED:20260812T182327Z
LAST-MODIFIED:20260814T160626Z
UID:2971-1787702400-1787961599@microsanj.com
SUMMARY:ASPS 2026
DESCRIPTION:Microsanj’s Korea representative\, ROIENTEC\, is exhibiting at the Advanced Semiconductor Packaging & Chiplet Show (ASPS) 2026\, and we’d love to see you there. \nASPS gathers South Korea’s packaging community around the technologies driving the industry forward: advanced packaging\, chiplets\, and HBM. As devices move to 3D heterogeneous integration\, understanding heat flow inside the package is more critical than ever. \nStop by Booth L109 to see how Microsanj’s thermoreflectance platforms deliver: \n\nSub-micron\, full-field thermal imaging of active devices and stacked die\nDepth-resolved characterization of TSVs\, interposers\, and TIMs\nIn-plane & cross-plane thermal conductivity of thin films and packaging materials\n\nThe ROIENTEC team and Microsanj Co-Founder & CEO Dr. Mo Shakouri will be on hand to discuss your packaging and thermal challenges. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/asps-2026/
LOCATION:Private: Suwon Convention Center\, 140 Gwanggyojungang-ro\, Yeongtong-gu\, Suwon-si\, Gyeonggi-do\, Korea\, Democratic People's Republic of
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/08/Logo-e1786559129274.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260831
DTEND;VALUE=DATE:20260905
DTSTAMP:20260814T154418Z
CREATED:20260615T182616Z
LAST-MODIFIED:20260814T154418Z
UID:2304-1788134400-1788566399@microsanj.com
SUMMARY:TFAWS 2026
DESCRIPTION:The Thermal and Fluids Analysis Workshop (TFAWS) is an annual training and professional development workshop that is designed to encourage knowledge sharing\, professional development\, and networking throughout the thermal and fluids engineering community within NASA and the aerospace community at large. The vision of TFAWS is to maintain continuity over time and between disciplines throughout the thermal and fluids engineering community. \nMicrosanj is pleased to announce that we will be exhibiting at TFAWS 2026 in Huntsville\, AL! \nRegister Now
URL:https://microsanj.com/events/tfaws-2026/
LOCATION:Embassy Suites by Hilton Huntsville\, 800 Monroe Street\, Huntsville\, AL\, 35801\, United States
CATEGORIES:Workshop
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260902
DTEND;VALUE=DATE:20260905
DTSTAMP:20260820T164241Z
CREATED:20260622T193145Z
LAST-MODIFIED:20260820T164241Z
UID:2455-1788307200-1788566399@microsanj.com
SUMMARY:SEMICON Taiwan 2026
DESCRIPTION:We’re proud to announce that Microsanj will be exhibiting at SEMICON Taiwan 2026\, at Booth S7330 in the California Pavilion. \nLed by GO-Biz\, the Governor’s Office of Business and Economic Development\, the California Pavilion showcases why California\, the world’s 5th-largest economy\, is the top U.S. destination for semiconductor investment: \n\n#1 in the U.S. for semiconductor jobs\n79% of all U.S. semiconductor venture capital\n47% of all U.S. semiconductor patents\n\nThis is your chance to see what we’ve been working on\, and we’d love to connect with you in person. Schedule a meeting with our team by filling out the form below\, and we’ll set aside dedicated time to meet you at Booth S7330. \nExhibition Dates: \n\nSeptember 2\, Wednesday\, 2026 | 10:00 am – 5:00 pm\nSeptember 3\, Thursday\, 2026 | 10:00 am – 5:00 pm\nSeptember 4\, Friday\, 2026 | 10:00 am – 4:00 pm\n\nSEMICON Taiwan is not just a platform that connects Taiwan and global microelectronics ecosystems but also a bridge that facilitates smooth collaboration between industry\, government\, academia\, and research institutions. \nDon’t leave your visit to chance. Fill out the form below to reserve your meeting time\, and let’s make the most of SEMICON Taiwan 2026 together. \nView Floorplan\nRegister Now
URL:https://microsanj.com/events/semicon-taiwan-2026/
LOCATION:Taipei Nangang Exhibition Center\, No. 1\, Jingmao 2nd Rd\, Sanzhong Village\, Nangang District\, Taipei City\, 115\, Taiwan
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/webp:https://microsanj.com/wp-content/uploads/2026/06/SCTaiwan_logo.webp
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20260910T090000
DTEND;TZID=America/Chicago:20260910T160000
DTSTAMP:20260805T142924Z
CREATED:20260731T183621Z
LAST-MODIFIED:20260805T142924Z
UID:2911-1789030800-1789056000@microsanj.com
SUMMARY:Advanced Semiconductor & Photonics Characterization Forum
DESCRIPTION:The Advanced Semiconductor Characterization Forum – Southwest is a free\, full-day in-person event on Thursday\, September 10\, 2026\, from 9:00 AM to 4:00 PM MT at the National Museum of Nuclear Science & History in Albuquerque\, NM (lunch and parking included). Co-hosted by Microsanj\, Keysight\, MPI Corporation\, Focus Microwaves\, and Gel Pak\, it brings together the quantum computing and semiconductor engineering communities across New Mexico and the Southwest for a morning of technical presentations covering RF\, photonics\, materials characterization\, and wide-bandgap devices\, followed by hands-on afternoon demo stations and a free museum tour.\nSpeakers include: \n\nLawrence Vandervegt (MPI Corporation) on scaling electro-optical component testing from R&D to high-volume manufacturing.\nSajjad Ahmed (Focus Microwaves) on advances in large-signal\, DC\, and noise-parameter RF measurement.\nDustin Kendig (Microsanj) on full-field thermoreflectance and multiphysics characterization of GaN and wide-bandgap RF devices.\nPlus sessions from Keysight and Gel Pak (Jim Portugal).\n\nApplication engineers will be on site all day\, making it a practical opportunity for RF engineers\, device researchers\, and test & measurement professionals to see the full characterization workflow in one place. \nRegister Now
URL:https://microsanj.com/events/advanced-semiconductor-photonics-characterization-forum/
LOCATION:Nuclear Science & History Museum\, 601 Eubank Blvd SE\, Albuquerque\, NM\, 87123\, United States
CATEGORIES:Workshop
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260921
DTEND;VALUE=DATE:20260925
DTSTAMP:20260831T163243Z
CREATED:20260622T200301Z
LAST-MODIFIED:20260831T163243Z
UID:2459-1789948800-1790294399@microsanj.com
SUMMARY:ESREF 2026
DESCRIPTION:Microsanj is proud to attend\, exhibit\, and present at ESREF 2026\, the 37th European Symposium on Reliability of Electron Devices\, Failure Physics and Analysis\, hosted at TU Wien in Vienna. \nStop by Booth B2 to meet our team and see how Microsanj’s thermal characterization and thermoreflectance imaging solutions help engineers and researchers tackle reliability and failure analysis challenges. \nIndustrial Session\nJoin us for our presentation and learn more about our latest capabilities: \n\nDate: Wednesday\, September 23\nTime: 14:20 – 14:40\nLocation: Villach Room (E18)\n\nOur representative\, CNROOD\, will be on site representing Microsanj\, and a Microsanj team will be present throughout the symposium to answer all of your questions. \nWe look forward to connecting with you in Vienna! \nRegister Now
URL:https://microsanj.com/events/esref-2026/
LOCATION:Faculty of Electrical Engineering and Information Technology (ETIT)\, Gußhausstraße 27-29\, 1040\, Vienna\, Austria
CATEGORIES:Trade Shows
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END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261004
DTEND;VALUE=DATE:20261009
DTSTAMP:20260915T164632Z
CREATED:20260615T194121Z
LAST-MODIFIED:20260915T164632Z
UID:2311-1791072000-1791503999@microsanj.com
SUMMARY:ISTFA 2026
DESCRIPTION:Microsanj will join the 52nd International Symposium for Testing and Failure Analysis (ISTFA) in San Antonio\, TX. As the premier event for the microelectronics failure analysis community\, ISTFA offers a platform for innovation and collaboration. This year\, we’ll be showcasing our OpenTest demo live at Booth #309. \nExhibit Hours: \n\nTues. Oct. 6 – 9:30 a.m. – 6:00 p.m.\nWed. Oct. 7 – 9:00 a.m. – 4:00 p.m.\n\nRegister Now \nView Floorplan
URL:https://microsanj.com/events/istfa-2026/
LOCATION:Henry B. Gonzalez Convention Center\, 900 E Market St\, San Antonio\, TX\, 78205\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/webp:https://microsanj.com/wp-content/uploads/2026/06/ISTFA_Logo.webp
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261004
DTEND;VALUE=DATE:20261010
DTSTAMP:20260914T152853Z
CREATED:20260615T191525Z
LAST-MODIFIED:20260914T152853Z
UID:2307-1791072000-1791590399@microsanj.com
SUMMARY:EuMW 2026
DESCRIPTION:European Microwave Week (EuMW) 2026 is Europe’s premier event dedicated to microwave\, RF\, wireless\, and radar technologies. EuMW 2026 also features the Defence\, Space\, Automotive\, and 6G Forums plus a range of workshops\, short courses\, and special events like Women in Microwave Engineering. Held alongside the conferences is the European Microwave Exhibition\, Europe’s largest RF and microwave trade show\, complete with technical seminars and exhibitor workshops highlighting the latest commercial products and processes. Microsanj will be exhibiting at Booth D20 in London! \nExhibit Hours: \n\nTuesday 6th October 2026\, 9.30-18.00 (followed by the Welcome Reception)\nWednesday 7th October 2026\, 9.30-17.30\nThursday 8th October 2026\, 9.30-16.30\n\nRegister Now \nView Floorplan
URL:https://microsanj.com/events/eumw-2026/
LOCATION:Excel London\, Royal Victoria Dock\, 1 Western Gateway\, London\, E16 1XL\, United Kingdom
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/06/eumw2026_logox.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261013
DTEND;VALUE=DATE:20261016
DTSTAMP:20260917T152945Z
CREATED:20260622T200807Z
LAST-MODIFIED:20260917T152945Z
UID:2463-1791849600-1792108799@microsanj.com
SUMMARY:SEMICON West 2026
DESCRIPTION:Microsanj is heading to SEMICON West in San Francisco\, CA! Join the world’s leading semiconductor companies\, innovators\, engineers\, and researchers shaping the future of microelectronics — and stop by booth #6763 to see us. \nExhibit Hours: \n\nTuesday\, October 13\, 2026 (10:00 am – 5:00 pm)\nWednesday\, October 14\, 2026 (10:00 am – 5:00 pm)\nThursday\, October 15\, 2026 (10:00 am – 4:00 pm)\n\nPresentation:\nJoin us at the APHI Summit – Day 1 (AM) for a featured talk from Mo Shakouri of Microsanj.\nSession: Power & Thermals I — Thermal is the New Node: Managing Power in 3D Systems \nTalk Title: Laser-Based TDTR and Thermoreflectance Imaging for Hybrid Bonding\, TSV Integrity\, and Co-Packaged Optics in 3DHI \nDate: Tuesday\, October 13\, 2026\nSession Time: 10:30 AM – 12:30 PM\nMo Shakouri’s Talk: 11:45 AM – 12:05 PM\nLocation: Room 156\, Moscone Center\, South Hall\, Upper Mezzanine \nView Floorplan \nRegister for a complimentary single-day Expo Pass
URL:https://microsanj.com/events/semicon-west-2026/
LOCATION:Moscone Center\, 747 Howard St\, San Francisco\, CA\, 94103\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/09/Semicon-West-Logo-e1788889939847.png
END:VEVENT
END:VCALENDAR