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BEGIN:VEVENT
DTSTART;VALUE=DATE:20261004
DTEND;VALUE=DATE:20261009
DTSTAMP:20260915T164632Z
CREATED:20260615T194121Z
LAST-MODIFIED:20260915T164632Z
UID:2311-1791072000-1791503999@microsanj.com
SUMMARY:ISTFA 2026
DESCRIPTION:Microsanj will join the 52nd International Symposium for Testing and Failure Analysis (ISTFA) in San Antonio\, TX. As the premier event for the microelectronics failure analysis community\, ISTFA offers a platform for innovation and collaboration. This year\, we’ll be showcasing our OpenTest demo live at Booth #309. \nExhibit Hours: \n\nTues. Oct. 6 – 9:30 a.m. – 6:00 p.m.\nWed. Oct. 7 – 9:00 a.m. – 4:00 p.m.\n\nRegister Now \nView Floorplan
URL:https://microsanj.com/events/istfa-2026/
LOCATION:Henry B. Gonzalez Convention Center\, 900 E Market St\, San Antonio\, TX\, 78205\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/webp:https://microsanj.com/wp-content/uploads/2026/06/ISTFA_Logo.webp
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260921
DTEND;VALUE=DATE:20260925
DTSTAMP:20260831T163243Z
CREATED:20260622T200301Z
LAST-MODIFIED:20260831T163243Z
UID:2459-1789948800-1790294399@microsanj.com
SUMMARY:ESREF 2026
DESCRIPTION:Microsanj is proud to attend\, exhibit\, and present at ESREF 2026\, the 37th European Symposium on Reliability of Electron Devices\, Failure Physics and Analysis\, hosted at TU Wien in Vienna. \nStop by Booth B2 to meet our team and see how Microsanj’s thermal characterization and thermoreflectance imaging solutions help engineers and researchers tackle reliability and failure analysis challenges. \nIndustrial Session\nJoin us for our presentation and learn more about our latest capabilities: \n\nDate: Wednesday\, September 23\nTime: 14:20 – 14:40\nLocation: Villach Room (E18)\n\nOur representative\, CNROOD\, will be on site representing Microsanj\, and a Microsanj team will be present throughout the symposium to answer all of your questions. \nWe look forward to connecting with you in Vienna! \nRegister Now
URL:https://microsanj.com/events/esref-2026/
LOCATION:Faculty of Electrical Engineering and Information Technology (ETIT)\, Gußhausstraße 27-29\, 1040\, Vienna\, Austria
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/06/cropped-cropped-cropped-ESREF-LOGO-original_2026_Website_Head-2-e1782158597736.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20260910T090000
DTEND;TZID=America/Chicago:20260910T160000
DTSTAMP:20260805T142924Z
CREATED:20260731T183621Z
LAST-MODIFIED:20260805T142924Z
UID:2911-1789030800-1789056000@microsanj.com
SUMMARY:Advanced Semiconductor & Photonics Characterization Forum
DESCRIPTION:The Advanced Semiconductor Characterization Forum – Southwest is a free\, full-day in-person event on Thursday\, September 10\, 2026\, from 9:00 AM to 4:00 PM MT at the National Museum of Nuclear Science & History in Albuquerque\, NM (lunch and parking included). Co-hosted by Microsanj\, Keysight\, MPI Corporation\, Focus Microwaves\, and Gel Pak\, it brings together the quantum computing and semiconductor engineering communities across New Mexico and the Southwest for a morning of technical presentations covering RF\, photonics\, materials characterization\, and wide-bandgap devices\, followed by hands-on afternoon demo stations and a free museum tour.\nSpeakers include: \n\nLawrence Vandervegt (MPI Corporation) on scaling electro-optical component testing from R&D to high-volume manufacturing.\nSajjad Ahmed (Focus Microwaves) on advances in large-signal\, DC\, and noise-parameter RF measurement.\nDustin Kendig (Microsanj) on full-field thermoreflectance and multiphysics characterization of GaN and wide-bandgap RF devices.\nPlus sessions from Keysight and Gel Pak (Jim Portugal).\n\nApplication engineers will be on site all day\, making it a practical opportunity for RF engineers\, device researchers\, and test & measurement professionals to see the full characterization workflow in one place. \nRegister Now
URL:https://microsanj.com/events/advanced-semiconductor-photonics-characterization-forum/
LOCATION:Nuclear Science & History Museum\, 601 Eubank Blvd SE\, Albuquerque\, NM\, 87123\, United States
CATEGORIES:Workshop
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260902
DTEND;VALUE=DATE:20260905
DTSTAMP:20260820T164241Z
CREATED:20260622T193145Z
LAST-MODIFIED:20260820T164241Z
UID:2455-1788307200-1788566399@microsanj.com
SUMMARY:SEMICON Taiwan 2026
DESCRIPTION:We’re proud to announce that Microsanj will be exhibiting at SEMICON Taiwan 2026\, at Booth S7330 in the California Pavilion. \nLed by GO-Biz\, the Governor’s Office of Business and Economic Development\, the California Pavilion showcases why California\, the world’s 5th-largest economy\, is the top U.S. destination for semiconductor investment: \n\n#1 in the U.S. for semiconductor jobs\n79% of all U.S. semiconductor venture capital\n47% of all U.S. semiconductor patents\n\nThis is your chance to see what we’ve been working on\, and we’d love to connect with you in person. Schedule a meeting with our team by filling out the form below\, and we’ll set aside dedicated time to meet you at Booth S7330. \nExhibition Dates: \n\nSeptember 2\, Wednesday\, 2026 | 10:00 am – 5:00 pm\nSeptember 3\, Thursday\, 2026 | 10:00 am – 5:00 pm\nSeptember 4\, Friday\, 2026 | 10:00 am – 4:00 pm\n\nSEMICON Taiwan is not just a platform that connects Taiwan and global microelectronics ecosystems but also a bridge that facilitates smooth collaboration between industry\, government\, academia\, and research institutions. \nDon’t leave your visit to chance. Fill out the form below to reserve your meeting time\, and let’s make the most of SEMICON Taiwan 2026 together. \nView Floorplan\nRegister Now
URL:https://microsanj.com/events/semicon-taiwan-2026/
LOCATION:Taipei Nangang Exhibition Center\, No. 1\, Jingmao 2nd Rd\, Sanzhong Village\, Nangang District\, Taipei City\, 115\, Taiwan
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/webp:https://microsanj.com/wp-content/uploads/2026/06/SCTaiwan_logo.webp
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260831
DTEND;VALUE=DATE:20260905
DTSTAMP:20260814T154418Z
CREATED:20260615T182616Z
LAST-MODIFIED:20260814T154418Z
UID:2304-1788134400-1788566399@microsanj.com
SUMMARY:TFAWS 2026
DESCRIPTION:The Thermal and Fluids Analysis Workshop (TFAWS) is an annual training and professional development workshop that is designed to encourage knowledge sharing\, professional development\, and networking throughout the thermal and fluids engineering community within NASA and the aerospace community at large. The vision of TFAWS is to maintain continuity over time and between disciplines throughout the thermal and fluids engineering community. \nMicrosanj is pleased to announce that we will be exhibiting at TFAWS 2026 in Huntsville\, AL! \nRegister Now
URL:https://microsanj.com/events/tfaws-2026/
LOCATION:Embassy Suites by Hilton Huntsville\, 800 Monroe Street\, Huntsville\, AL\, 35801\, United States
CATEGORIES:Workshop
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260826
DTEND;VALUE=DATE:20260829
DTSTAMP:20260814T160626Z
CREATED:20260812T182327Z
LAST-MODIFIED:20260814T160626Z
UID:2971-1787702400-1787961599@microsanj.com
SUMMARY:ASPS 2026
DESCRIPTION:Microsanj’s Korea representative\, ROIENTEC\, is exhibiting at the Advanced Semiconductor Packaging & Chiplet Show (ASPS) 2026\, and we’d love to see you there. \nASPS gathers South Korea’s packaging community around the technologies driving the industry forward: advanced packaging\, chiplets\, and HBM. As devices move to 3D heterogeneous integration\, understanding heat flow inside the package is more critical than ever. \nStop by Booth L109 to see how Microsanj’s thermoreflectance platforms deliver: \n\nSub-micron\, full-field thermal imaging of active devices and stacked die\nDepth-resolved characterization of TSVs\, interposers\, and TIMs\nIn-plane & cross-plane thermal conductivity of thin films and packaging materials\n\nThe ROIENTEC team and Microsanj Co-Founder & CEO Dr. Mo Shakouri will be on hand to discuss your packaging and thermal challenges. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/asps-2026/
LOCATION:Private: Suwon Convention Center\, 140 Gwanggyojungang-ro\, Yeongtong-gu\, Suwon-si\, Gyeonggi-do\, Korea\, Democratic People's Republic of
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/08/Logo-e1786559129274.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260802
DTEND;VALUE=DATE:20260808
DTSTAMP:20260727T154336Z
CREATED:20260615T182150Z
LAST-MODIFIED:20260727T154336Z
UID:2299-1785628800-1786147199@microsanj.com
SUMMARY:IWGO 2026
DESCRIPTION:Microsanj is proud to announce that we are gold sponsors for the International Workshop on Gallium Oxide and Related Materials (IWGO-6)\, which is the most prestigious international forum for Ga2O3 and related materials. The sixth workshop is scheduled for August 2-7\, 2026\, in College Park\, Maryland. \nExhibit Hours: \n\nMonday: 9:00 a.m.-5:30 p.m.\nTuesday-Thursday: 8:30 a.m.-5:30 p.m.\nFriday: 8:30 a.m.-11:00 a.m.\n\nLearn More
URL:https://microsanj.com/events/iwgo-2026/
LOCATION:Edward St. John Learning & Teaching Center\, 4131 Campus Drive\, College Park\, MD\, 20742\, United States
CATEGORIES:Workshop
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/06/Screenshot-2026-06-15-at-11.21.28-AM.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260707
DTEND;VALUE=DATE:20260708
DTSTAMP:20260622T163642Z
CREATED:20260615T181804Z
LAST-MODIFIED:20260622T163642Z
UID:2295-1783382400-1783468799@microsanj.com
SUMMARY:ThermCon 2026
DESCRIPTION:Microsanj is excited to announce that our Co-Founder  & CEO\, Dr. Mo Shakouri\, will be speaking at the ThermCon 2026 in Santa Clara\, CA. Here are his presentation details: \n\nDate: 7/7/26\nTime: 4:30 – 4:55 PM\nPresentation: Wide dynamic range laser heating thermoreflectance characterization of multi-layer films and 3D integrated circuits.\n\nThermal management is becoming a very important area for semiconductor packaging\, and there are many new developments in semiconductor design (chip and package)\, thermal interface materials\, various cooling technologies (heat spreader\, heat sink\, vapor chamber\, immersive cooling\, cold plate\, 2-phase cooling\, microchannels\, etc.)\, testing\, measurement and characterization\, modeling and simulation\, etc. This conference will bring together participants from around the world\, from academia\, research institutions\, and industry (fabless\, IDM\, OSAT\, materials\, cooling modules\, etc.)\, into a conference for a focused exchange and in-depth interactions. \nLearn More
URL:https://microsanj.com/events/thermcon-2026/
LOCATION:Hyatt Regency Santa Clara\, 5101 Great America Pkwy\, Santa Clara\, CA\, 95054\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/06/Screenshot-2026-06-15-at-11.17.35-AM.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260607
DTEND;VALUE=DATE:20260613
DTSTAMP:20260507T190933Z
CREATED:20260227T200144Z
LAST-MODIFIED:20260507T190933Z
UID:1886-1780790400-1781308799@microsanj.com
SUMMARY:IMS 2026
DESCRIPTION:The IEEE International MTT Symposia (IMS) is the world’s premier RF and microwave technical conference and industry exhibition. Thousands of industry professionals from around the world gather here to connect\, see the latest technology advancements\, and discover cutting-edge theories\, tools\, and techniques. \n\n\n\nMicrosanj will exhibit\, present\, and host a workshop at IMS 2026 in Boston\, MA! Visit us at Booth 12027 to experience live demonstrations\, speak with Microsanj experts about your thermal challenges and how our tools can help optimize your designs\, and receive exclusive giveaways. \n🗓 EXHIBIT HALL HOURS \n\nTuesday\, June 9: 9:30 AM – 5:00 PM\nWednesday\, June 10: 9:30 AM – 6:00 PM\nThursday\, June 11: 9:30 AM – 3:00 PM\n\n\n\nView Floorplan \nRegister \n\n🎤 Microapps Presentation\nAdvances In Thermal Analysis to Address the Growing Thermal Challenges of 3D Heterogeneous Integration📅 6/9/2026🕗 3:42 PM – 3:57 PM📍 MicroApps Theater (Booth 15122) \n\n🎤 Advanced Thermal Management in RF Systems: From Wide-Bandgap Materials to Industrial Implementation Workshop \n📅  6/8/26🕗 8:00 AM – 11:50 AM📍 Room 157C \nJoin us at IMS 2026 for Advanced Thermal Management in RF Systems: From Wide-Bandgap Materials to Industrial Implementation—a must-attend workshop exploring the future of thermal design in high-power RF and microwave applications. This expert-led program brings together leading voices from Stanford University\, University of Connecticut\, GlobalFoundries\, Université Catholique de Louvain\, DARPA\, and Microsanj LLC. Sessions span wide-bandgap materials\, transient thermal dynamics\, advanced modeling\, self-heating mitigation\, and cutting-edge thermoreflectance imaging—culminating in a holistic\, system-level approach to thermal-electromagnetic co-design. Don’t miss this opportunity to learn from top researchers and industry innovators shaping the next decade of RF thermal management. \n\nSpeakers: \n\nProf. Srabanti Chowdhury – Stanford University\nProf Georges Pavlidis – University of Connecticut\nOscar D. Restrepo – Global Foundries\nProf. Jean-Pierre Raskin – Université Catholique de Louvain (Presented by Martin Vanbrabant)\nYogendra Joshi- DARPA\nMo Shakouri – Microsanj LLC
URL:https://microsanj.com/events/ims-2026/
LOCATION:Thomas M. Menino Convention & Exhibition Center (MCEC)\, 415 Summer St\, Boston\, MA\, 02210\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/02/IMS2026-logo-RGB_Badge-e1772222568995.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260527
DTEND;VALUE=DATE:20260528
DTSTAMP:20260501T162834Z
CREATED:20260501T162718Z
LAST-MODIFIED:20260501T162834Z
UID:2111-1779840000-1779926399@microsanj.com
SUMMARY:Benelux RF&IC Conference 2026
DESCRIPTION:Our international representative\, CNROOD\, has taken on the role of a Gold Sponsor at the Benelux RF & IC Conference 2026. This premier event is an exhibition and conference on advanced chip development in the Low Countries\, bringing together the RF\, analog & mixed-signal\, and digital communities \nAs part of their sponsorship\, CNROOD will proudly represent Microsanj at the conference\, showcasing our cutting-edge solutions and expertise. We invite attendees to connect with the CNROOD team to learn more about our innovative thermal analysis tools and their applications in RF and microwave technologies. \nIf you would like to learn more or to register\, you can view the event website.
URL:https://microsanj.com/events/benelux-rfic-conference-2026/
LOCATION:Mikrocentrum\, De Run 1115\, 5503 LB De Run 1115\, 5503 LB\, Veldhoven\, Netherlands
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/05/Benelux-RFIC-2026-logo-rgb-150-e1777652833318.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260527
DTEND;VALUE=DATE:20260528
DTSTAMP:20260514T141831Z
CREATED:20260429T201814Z
LAST-MODIFIED:20260514T141831Z
UID:2097-1779840000-1779926399@microsanj.com
SUMMARY:Multiphysics Characterization of GaN and Wide‑Bandgap RF Devices: Correlating Pulsed‑IV\, RF\, and Thermoreflectance Thermal Imaging Measurements (Technical Webinar)
DESCRIPTION:Exploring how multiphysics approaches are unlocking new understanding of GaN\, SiC\, and next-generation semiconductor devices. \n\n\n\n\nEvent Details\n\nDate: Wednesday\, May 27\, 2026\nLocation: Virtual\nTime: 7:00 AM – 8:00 AM PDT & 7:00 PM – 8:00 PM PDT\n\n\n\n\nLearn More & Register Now
URL:https://microsanj.com/events/technical-webinar-may-27-2026-multiphysics-characterization-of-gan-and-wide-bandgap-rf-devices-correlating-pulsed-iv-rf-and-thermoreflectance-thermal-imaging-measurement/
LOCATION:Virtual
CATEGORIES:Webinar
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/04/Webinar-Social-Media-Image-e1777493935499.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260526
DTEND;VALUE=DATE:20260530
DTSTAMP:20260420T210814Z
CREATED:20260323T153141Z
LAST-MODIFIED:20260420T210814Z
UID:1956-1779753600-1780099199@microsanj.com
SUMMARY:ECTC 2026
DESCRIPTION:The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging\, components\, and microelectronic systems science\, technology\, and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT). \nWe’re proud to announce our sponsorship of the 2026 IEEE EPS Heterogeneous Integration Roadmap (HIR) Workshop at ECTC in Orlando\, FL. \nThis full-day workshop on Tuesday\, May 26 brings together leaders in advanced packaging to discuss the technologies shaping our industry’s future. The day features four technical sessions covering topics including Additive Electronics Manufacturing (AME) for Advanced Packaging and CHIPS R&D Metrology\, chaired by Ravi Mahajan of Intel Corporation and William Chen of ASE. \nAs thermal imaging plays an increasingly critical role in heterogeneous integration and advanced packaging\, Microsanj is honored to support the important work happening in this space. \nRegister Now \nSchedule a meeting with us \n 
URL:https://microsanj.com/events/ectc-2026/
LOCATION:JW Marriott Orlando\, Grande Lakes\, 4040 Central Florida Parkway\, Orlando\, FL\, 32837\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/03/ectclogo-circle-2026-year-e1774279917900.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260526
DTEND;VALUE=DATE:20260530
DTSTAMP:20260427T175040Z
CREATED:20260323T152549Z
LAST-MODIFIED:20260427T175040Z
UID:1952-1779753600-1780099199@microsanj.com
SUMMARY:ITherm 2026
DESCRIPTION:We’re pleased to announce that we are gold sponsors. Come visit us on the exhibit floor for a demo\, and don’t miss our sponsored presentation on Friday\, May 29\, from 11:30–11:45 AM in Room 3. \nITherm 2026 will be held alongside the 76th Electronic Components and Technology Conference (ECTC 2026 – http://www.ectc.net)\, a premier electronics packaging conference\, at the JW Marriott Orlando\, Grande Lakes\, Orlando\, Florida\, USA. Joint registrations will be available at a discounted rate. In addition to paper presentations and vendor exhibits\, ITherm 2026 will include panel discussions\, keynote lectures by prominent speakers\, invited technology talks\, ECTC/ITherm joint networking events and short courses\, and a student design competition. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/itherm-2026/
LOCATION:JW Marriott Orlando\, Grande Lakes\, 4040 Central Florida Parkway\, Orlando\, FL\, 32837\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/03/Screenshot-2026-03-23-at-8.22.18-AM-e1774279583707.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260522
DTEND;VALUE=DATE:20260523
DTSTAMP:20260501T162853Z
CREATED:20260501T162336Z
LAST-MODIFIED:20260501T162853Z
UID:2103-1779408000-1779494399@microsanj.com
SUMMARY:Benelux Heterogeneous Integration Conference 2026
DESCRIPTION:Our international representative\, CNROOD\, has taken on the role of a Bronze Sponsor at the Benelux Heterogeneous Integration Conference 2026. This premier event is an exhibition and conference on advanced semiconductor systems development in the Low Countries\, bringing together the semiconductor\, optical communication\, photonics\, and equipment communities\, focusing on advanced packaging \nAs part of their sponsorship\, CNROOD will proudly represent Microsanj at the conference\, showcasing our cutting-edge solutions and expertise. We invite attendees to connect with the CNROOD team to learn more about our innovative thermal analysis tools and their applications in RF and microwave technologies. \nIf you would like to learn more or to register\, you can view the event website.
URL:https://microsanj.com/events/benelux-heterogeneous-integration-conference-2026/
LOCATION:Mikrocentrum\, De Run 1115\, 5503 LB De Run 1115\, 5503 LB\, Veldhoven\, Netherlands
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/05/BHIC-logo-L-e1777652611938.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260518
DTEND;VALUE=DATE:20260522
DTSTAMP:20260427T174659Z
CREATED:20260226T175923Z
LAST-MODIFIED:20260427T174659Z
UID:1881-1779062400-1779407999@microsanj.com
SUMMARY:CS Mantech 2026 - International Conference on Compound Semiconductor Manufacturing Technology
DESCRIPTION:Microsanj will be exhibiting at Booth #213 for a live demo showcasing GaN thermal imaging with our EZ THERM system. It’s the perfect opportunity to see the technology in action and meet the team. We’d love to chat about how our solutions can support your work. \nExhibit Hours: \n\nTuesday\, May 19th (7:00 AM – 5:00 PM)\nWednesday\, May 20th (7:00 AM – 1:30 PM)\n\nMicrosanj will also be presenting at the exhibits forum on Tuesday\, May 19th\, happening from 5:00 PM – 6:00 PM at Salons A – D (Lower Level I). \nCS MANTECH is a not-for-profit organization whose focus is to provide a forum for members of the compound semiconductor community to exchange and discuss new ideas to better serve the public in general. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/cs-mantech-2026-international-conference-on-compound-semiconductor-manufacturing-technology/
LOCATION:Portland Marriott Downtown Waterfront\, 1401 SW Naito Pkwy\, Portland\, OR\, 97201\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/02/cs-mantech-logo-e1772223404979.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260429
DTEND;VALUE=DATE:20260501
DTSTAMP:20260311T165238Z
CREATED:20260311T165006Z
LAST-MODIFIED:20260311T165238Z
UID:1905-1777420800-1777593599@microsanj.com
SUMMARY:SEMIEXPO Heartland 2026
DESCRIPTION:Dr. Mo Shakouri will be a part of Session 3: Thermal Management & Power Delivery in Advanced Packaging: From TIMs to Warpage Control by presenting Meeting Emerging Thermal Challenges of 3D Heterogeneously Integrated Circuit Packaging Techniques on Thursday\, April 30\, from 10:05 AM – 10:25 AM. \nSEMIEXPO Heartland 2026 brings together the automotive and semiconductor ecosystems to explore the technologies redefining mobility and manufacturing. From software-defined and self-driving vehicles to electrified mobility\, the event highlights how cutting-edge chip technologies\, smart sensing systems\, and artificial intelligence are powering the next generation of transportation. Through a dynamic lineup of keynotes\, expert presentations\, and panel discussions\, attendees will exchange perspectives on the trends shaping the future—while actively contributing to the conversation. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/semiexpo-heartland-2026/
LOCATION:Detroit Marriott at the Renaissance Center\, Renaissance Center\, 400 Renaissance Dr W\, Detroit\, MI\, 48243\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/03/Logo.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260427
DTEND;VALUE=DATE:20260429
DTSTAMP:20260408T144754Z
CREATED:20260226T175334Z
LAST-MODIFIED:20260408T144754Z
UID:1875-1777248000-1777420799@microsanj.com
SUMMARY:Industry Day and Birck Research Symposium 2026
DESCRIPTION:Microsanj is proud to be a Gold Sponsor for the 2nd annual symposium. We will be exhibiting our latest systems and speaking on our collaborations within the nanotechnology ecosystem. Visit our booth to see our EZ500 live demo\, featuring high-resolution thermal imaging solutions that utilize advanced thermoreflectance and infrared (IR+TR) technology. These innovations are designed to enhance semiconductor testing\, RF analysis\, and materials research. \nOur Co-Founder & CEO\, Mo Shakouri\, will also be presenting: \nMeeting Emerging Thermal Challenges of 3D Heterogeneously Integrated Circuit Packaging Techniques. \n\n4/27\, 10:30 AM – 11:10 AM\nBurton Morgan Center for Entrepreneurship\, MRGN 121\n\nThe Birck Research Symposium is a one-day event showcasing cutting-edge innovation in nanoscience and advanced technology at the Birck Nanotechnology Center at Purdue University. Bringing together researchers\, students\, and industry professionals\, the symposium features research presentations\, keynote talks\, and networking opportunities designed to spark collaboration and highlight breakthrough discoveries. The event takes place at the Hall for Discovery and Learning Research in West Lafayette\, Indiana. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/industry-day-and-birck-research-symposium-2026/
LOCATION:Birck Nanotechnology Center\, 1205 W State St\, West Lafayette\, IN\, 47907
CATEGORIES:Symposium
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260415
DTEND;VALUE=DATE:20260416
DTSTAMP:20260408T174134Z
CREATED:20260323T212216Z
LAST-MODIFIED:20260408T174134Z
UID:1962-1776211200-1776297599@microsanj.com
SUMMARY:Technical Webinar — April 15\, 2026 (Nanosecond & Picosecond Pump-Probe Techniques For Thermal Characterization of Advanced Packages)
DESCRIPTION:Nanosecond and picosecond pump-probe techniques for thermal characterization of advanced packages — real measurement data\, external speakers\, live Q&A.\n\n\n\n\nEvent Details\n\nDate: Wednesday\, April 15\, 2026\nLocation: Virtual\nTime: 7:00 AM – 8:00 AM PDT & 7:00 PM – 8:00 PM PDT\n\n\n\n\nLearn More & Register Now
URL:https://microsanj.com/events/technical-webinar-april-15-2026-optical-sampling-thermoreflectance-for-3d-heterogeneous-integration/
CATEGORIES:Webinar
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END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260314
DTEND;VALUE=DATE:20260320
DTSTAMP:20260306T174420Z
CREATED:20260113T222045Z
LAST-MODIFIED:20260306T174420Z
UID:1784-1773446400-1773964799@microsanj.com
SUMMARY:APEX 2026
DESCRIPTION:Microsanj is exhibiting at APEX 2026 in Anaheim\, CA\, at the Anaheim Convention Center\, taking place March 14–19. \n📍 Booth #4203\n🕒 Exhibit Hours \n\nTuesday\, 3/17: 10:00 AM – 6:00 PM\nWednesday\, 3/18: 9:00 AM – 6:00 PM\nThursday\, 3/19: 9:00 AM – 2:00 PM\n\nMicrosanj is a global leader in optical thermal characterization\, delivering 250nm spatial resolution and 500 picosecond transient time resolution for pinpoint accuracy. Our systems empower engineers and researchers to see\, measure\, and understand thermal behavior at submicron scales —driving reliability and innovation in open-circuit failures\, GaN\, RF\, power amplifiers\, material characterization\, and more. Stop by our booth to experience: \n\nLive Demonstrations\nMeet the Microsanj Team\n\nIn addition to our booth\, check out 3 presentations from our Co-Founder & CEO\, Mo Shakouri: \nS5: Metrology Tools and Techniques 1 \n\n3/17\, 10:30 AM – 12:00 PM\nAdvanced Electronic Packaging Conference\, Room 304C\n\nMeeting Emerging Thermal Challenges of 3D Heterogeneously Integrated Circuit Packaging Techniques \n\n3/17\, 2:00 PM – 2:30 PM\nTechnology Pavilion\, Booth 4650\n\nPanel Discussion – Advancements in Metrology Tools and Techniques \n\n3/17\, 4:15 PM – 5:00 PM\nAdvanced Electronic Packaging Conference\, Room 304AB\n\nAPEX EXPO is the premier event in North America for the electronics industry. OEMs\, EMS providers\, PCB manufacturers\, and industry professionals from around the globe come together to access the latest technical content\, contribute to standards development\, and network with the industry’s largest gathering of capital equipment manufacturers\, suppliers\, and product innovators in design\, printed board manufacturing\, electronics assembly\, and test. \nFloorplan \nRegister Now (Use Promo Code 119907 for a free exhibit hall only pass) \nSchedule a meeting with us
URL:https://microsanj.com/events/apex-2026/
LOCATION:Anaheim Convention Center\, 800 W Katella Ave\, Anaheim\, CA\, 92802\, United States
CATEGORIES:Trade Shows
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END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20260309T183000
DTEND;TZID=UTC:20260309T203000
DTSTAMP:20260226T005221Z
CREATED:20260219T171810Z
LAST-MODIFIED:20260226T005221Z
UID:1846-1773081000-1773088200@microsanj.com
SUMMARY:Microsanj Open House
DESCRIPTION:Join us the evening before our Semi-Therm workshop for an interactive showcase of Microsanj’s transient thermoreflectance systems\, IR/OpenTEST platform demonstrations\, with hands-on stations staffed by Microsanj experts and partner MPI. The Open House includes a special talk by Dr. Ali Shakouri on “Nanoscale Thermal Transport and Characterization for Heterogeneous Integration\,” themed discussion corners on GaN/WBG power\,3DHI packaging\, and RF/mmWave/THz\, and light refreshments. \nRSVP Now
URL:https://microsanj.com/events/microsanj-open-house/
LOCATION:Microsanj Headquarters\, 48421 Milmont Drive\, Fremont\, CA\, 94538\, United States
CATEGORIES:Open House
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260309
DTEND;VALUE=DATE:20260313
DTSTAMP:20260303T185229Z
CREATED:20260113T220037Z
LAST-MODIFIED:20260303T185229Z
UID:1770-1773014400-1773359999@microsanj.com
SUMMARY:GOMACTech 2026
DESCRIPTION:Microsanj is exhibiting at GOMACTech in New Orleans\, LA\, at the Ernest N. Morial Convention Center\, taking place from March 9 to 12. \n📍 Booth #500\n🕒 Exhibit Hours \n\nMarch 10\, 2026 (Tuesday): 12:00 PM to 8:00 PM\nMarch 11\, 2026 (Wednesday): 9:00 AM to 4:00 PM\n\nMicrosanj is excited to exhibit at GOMACTech 2026\, showcasing the latest innovations in thermoreflectance (TR) and infrared (IR) thermal analysis. Visit booth #500 for an exclusive\, hands-on experience with the EZ-THERM showcasing GaN\, designed to deliver real-time temperature mapping and transient thermal analysis—essential for high-performance semiconductor\, RF\, and power electronics applications. Stop by our booth to experience: \n\nLive Demonstrations\nFree Giveaways\nMeet the Microsanj Team\n\nGOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968\, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC\, and provides a forum for government reviews. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/gomactech-2026/
LOCATION:New Orleans Ernest N. Morial Convention Center\, 900 Convention Center Blvd\, New Orleans\, LA\, New Orleans\, CA\, 70130\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/01/2026_Logo-e1769704078938.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260309
DTEND;VALUE=DATE:20260313
DTSTAMP:20260224T225947Z
CREATED:20260113T215402Z
LAST-MODIFIED:20260224T225947Z
UID:1764-1773014400-1773359999@microsanj.com
SUMMARY:Semi-Therm 2026
DESCRIPTION:The SEMI-THERM Symposium is an annual conference dedicated to the thermal management\, design\, and characterization of electronic components and systems. It brings together engineers\, researchers\, and industry professionals to share knowledge\, explore innovations\, and network within the thermal engineering field. The event includes technical presentations\, workshops\, an exhibition showcasing cutting-edge products\, and opportunities for collaboration. \nMicrosanj is excited to announce that we are exhibiting\, presenting\, and having a workshop at Semi-Therm\, taking place in San Jose\, CA. \nVisit us at booth 304 for a live demonstration of the EZ-THERM system\, highlighting open-test & GaN capabilities and the powerful synergy of Infrared (IR) and Thermoreflectance (TR) thermal analysis. \nIn addition to our booth\, check out 3 presentations: \nMicrosanj Exhibitor Workshop \n\n\n\n3/10\, 3:00 PM – 4:45 PM\nFir Room\n\n\n\nTesting & Measurement: Absolute and Relative Temperature Measurements by Transient Gate Resistance Thermometry and Transient Thermoreflectance Imaging \n\n\n\n3/12\, 8:40 AM – 9:00 AM\nOak Room\nGeorges Pavlidis (Professor at University of Connecticut and Microsanj Customer)\n\n\n\nAssorted Topics: Optical Pump Probe Technique with Thermoreflectance Imaging Addresses Thermal Analysis Challenges with Multilayer Structures \n\n\n\n3/12\, 9:20 AM – 9:40 AM\nFir Room\nMo Shakouri (CEO at Microsanj)\n\n\n\nRegister Now \nFloorplan \nSchedule a meeting with us
URL:https://microsanj.com/events/semi-therm-2026/
LOCATION:DoubleTree by Hilton San Jose\, 2050 Gateway Pl\, San Jose\, CA\, 95110\, United States
CATEGORIES:Trade Shows
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END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260309
DTEND;VALUE=DATE:20260312
DTSTAMP:20260217T193456Z
CREATED:20260113T221607Z
LAST-MODIFIED:20260217T193456Z
UID:1780-1773014400-1773273599@microsanj.com
SUMMARY:GEMIC 2026
DESCRIPTION:Microsanj is pleased to announce that our international representative\, HITECH\, will be serving as a Silver Sponsor at the upcoming GEMIC 2026 conference in Dresden\, Germany. GEMIC (German Microwave Conference) is a premier event that brings together researchers\, industry leaders\, and professionals in the field of microwave and RF technology\, offering a platform for exchanging ideas and showcasing innovative advancements. \nAs a Silver Sponsor\, HITECH will proudly represent Microsanj\, highlighting our state-of-the-art thermal analysis solutions\, including our thermoreflectance technology\, which is transforming thermal management and characterization in high-frequency and high-power applications. \nDon’t miss this opportunity to connect with the HITECH team and explore the future of thermal and device characterization technologies at GEMIC 2026. \nIf you would like to learn more or to register\, you can view the event website.
URL:https://microsanj.com/events/gemic-2026/
LOCATION:AUDIMAX\, Campus South\, Karlsruhe Institute of Technology\, Germany
CATEGORIES:Trade Shows
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END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260224
DTEND;VALUE=DATE:20260227
DTSTAMP:20260126T190409Z
CREATED:20260113T214551Z
LAST-MODIFIED:20260126T190409Z
UID:1760-1771891200-1772150399@microsanj.com
SUMMARY:DesignCon 2026
DESCRIPTION:Microsanj is exhibiting at DesignCon in Santa Clara\, CA\, at the Santa Clara Convention Center\, taking place from February 24 to 26. \n📍 Booth #1551\n🕒 Exhibit Hours \n\nWednesday\, February 25\, 2026: 11 a.m.–6 p.m.\nThursday\, February 26\, 2026: 11 a.m.–6 p.m.\n\nMicrosanj is excited to announce that we are exhibiting at Design Con\, taking place at the Santa Clara Convention Center in Santa Clara\, CA. Visit us at booth 1551 to experience a live demonstration of our EZ-THERM system\, showcasing open test and the powerful combination of Infrared (IR) and Thermoreflectance (TR) thermal analysis\, and meet the Microsanj team. \nDesignCon is the premier high-speed communications and system design conference and exposition\, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. \nRegister Now \nUse promo code “INVITE1018447” for a 15% discount on conference packages and/or a FREE expo package \nFloorplan \nSchedule a meeting with us
URL:https://microsanj.com/events/design-con/
LOCATION:Santa Clara Convention Center\, 5001 Great America Pkwy\, Santa Clara\, CA\, 95054\, United States
CATEGORIES:Trade Shows
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END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260219
DTEND;VALUE=DATE:20260221
DTSTAMP:20260210T153331Z
CREATED:20260113T213458Z
LAST-MODIFIED:20260210T153331Z
UID:1758-1771459200-1771631999@microsanj.com
SUMMARY:Annual HIR Symposium 2026
DESCRIPTION:Microsanj is excited to be a Gold Sponsor at the Annual HIR Symposium! Visit our table for a live demonstration of the EZ-THERM system\, highlighting open-test capabilities and the powerful synergy of Infrared (IR) and Thermoreflectance (TR) thermal analysis. \nMeet the team and see how our products can support your thermal analysis needs. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/annual-hir-symposium/
LOCATION:SEMI Headquarters\, 673 S Milpitas Blvd\, Milpitas\, CA\, 95035\, United States
CATEGORIES:Symposium
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260211
DTEND;VALUE=DATE:20260214
DTSTAMP:20260126T195617Z
CREATED:20260126T194619Z
LAST-MODIFIED:20260126T195617Z
UID:1818-1770768000-1771027199@microsanj.com
SUMMARY:SEMICON Korea 2026
DESCRIPTION:Our Co-Founder and CEO\, Mo Shakouri\, along with our partner MPI and our Korea representatives\, ENSSEL and ROIENTEC CO.\, LTD.\, will be exhibiting SEMICON Korea at the COEX Convention Center in Seoul from February 11–13. \n📍 MPI Booth #W705 \n📍 ENSSEL Booth #G101 \n🕒 Exhibit Hours \n\nFebruary 11\, 2026 | 10:00-17:00 (Last entry 16:30)\nFebruary 12\, 2026 | 10:00-17:00 (Last entry 16:30)\nFebruary 13\, 2026 | 10:00-16:00 (Last entry 15:30)\n\nThermal issues rarely announce themselves—until they become returns\, downtime\, or warranty costs. Microsanj detects submicron hotspots and measures thermal resistance non-destructively\, enabling you to isolate risk early and build confidence in reliability predictions. \nRegister Now \nFloorplan \nSchedule a meeting with us
URL:https://microsanj.com/events/semicon-korea-2026/
LOCATION:COEX Convention & Exhibition Center\, 513 Yeongdong-daero\, Seoul\, Korea\, Democratic People's Republic of
CATEGORIES:Trade Shows
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END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260118
DTEND;VALUE=DATE:20260122
DTSTAMP:20260113T221716Z
CREATED:20251218T204639Z
LAST-MODIFIED:20260113T221716Z
UID:1748-1768694400-1769039999@microsanj.com
SUMMARY:RWW 2026
DESCRIPTION:Microsanj is starting the year strong by exhibiting at Radio Wireless Week (RWW) in Los Angeles / Hollywood at the Loews Hollywood Hotel\, taking place January 19–20. \n📍 Booth #103\n🕒 Exhibit Hours \n\nMonday\, 1/19: 1:00 PM – 7:00 PM\nTuesday\, 1/20: 9:00 AM – 5:00 PM\n\nMicrosanj is a global leader in optical thermal characterization\, delivering 250nm spatial resolution and 500 picosecond transient time resolution for pinpoint accuracy. Our systems empower engineers and researchers to see\, measure\, and understand thermal behavior at submicron scales —driving reliability and innovation in open-circuit failures\, GaN\, RF\, power amplifiers\, material characterization\, and more. Stop by our booth to experience: \n\nLive Demonstrations\nFree Giveaways\nMeet the Microsanj Team\n\nRadio Wireless Week is a premier event for the RF and wireless community\, bringing together engineers\, researchers\, and industry leaders to explore the latest advancements in RF technologies. We look forward to connecting with you in Hollywood! \nRegister Now \nSCHEDULE A MEETING WITH US
URL:https://microsanj.com/events/rww-2026/
LOCATION:Lowes Hollywood Hotel\, 1755 Highland Ave\, Los Angeles\, CA\, 90028\, United States
CATEGORIES:Trade Shows
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END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251214
DTEND;VALUE=DATE:20251219
DTSTAMP:20251111T163925Z
CREATED:20251111T160817Z
LAST-MODIFIED:20251111T163925Z
UID:1723-1765670400-1766102399@microsanj.com
SUMMARY:IEEE MAPCON 2025
DESCRIPTION:IEEE Microwaves\, Antennas and Propagation Conference (IEEE MAPCON 2025) will be held at Lulu International Convention Centre\, Grand Hyatt Bolgatty\, Kochi (India) from December 14 – 18\, 2025. MAPCON 2025 will offer a comprehensive international platform for the symbiotic sharing of cutting-edge research and technologies in the fields of electromagnetics\, microwave engineering\, and antenna and propagation. The event will bring together leading researchers\, engineers\, technocrats\, and practitioners from around the world to share their knowledge and expertise. \nWe’re pleased to share that our India representatives\, Jyoti Electronics & Step Electronics Pvt. Ltd\, will be attending MAPCON 2025\, a leading conference focused on electromagnetics\, microwave engineering\, and antenna and propagation. This participation reinforces our growing presence in India’s rapidly expanding semiconductor ecosystem.
URL:https://microsanj.com/events/ieee-mapcon-2025/
LOCATION:Lulu Bolgatty International Convention Center (LBICC)\, Bolgatty Island\, adjacent to Grand Hyatt\, Bolgatty\, Kochi\, 682504\, India
CATEGORIES:Trade Shows
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END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251202
DTEND;VALUE=DATE:20251206
DTSTAMP:20251124T210045Z
CREATED:20250821T144545Z
LAST-MODIFIED:20251124T210045Z
UID:1582-1764633600-1764979199@microsanj.com
SUMMARY:EPTC 2025
DESCRIPTION:The IEEE Electronics Packaging Technology Conference (EPTC)\, the flagship IEEE EPS conference in the Asia-Pacific region\, will be held in Singapore. Microsanj is proud to be a Bronze Sponsor of this highly respected global event. \nAli Shakouri\, Ph.D.\, will present two presentations: \n\nOverview of 3D Heterogeneously Integrated Circuit Packaging Characterization Techniques on 12/3 at 8:30 AM – 10:00 AM\nThermal Characterization and AI Analytics for 3D Heterogeneous Integrated Circuits on 12/5 at 11:00 AM – 11:30 AM\n\nRegister Now
URL:https://microsanj.com/events/eptc-2025/
LOCATION:Resorts World Sentosa\, 8 Sentosa Gateway\, Singapore
CATEGORIES:Trade Shows
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END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251120
DTEND;VALUE=DATE:20251122
DTSTAMP:20251028T145435Z
CREATED:20251028T145355Z
LAST-MODIFIED:20251028T145435Z
UID:1682-1763596800-1763769599@microsanj.com
SUMMARY:IEEE REPP Symposium 2025
DESCRIPTION:The 2025 IEEE REPP is a two-day technical event focused on Reliability for Electronics and Photonics Packaging and is taking place at the SEMI Headquarters in Milpitas\, CA! \nMicrosanj is excited to announce that we are a silver sponsor for this event\, and our very own Dustin Kendig will be presenting “Thermal Analysis Techniques to Address the Growing Thermal Challenges with Heterogeneous Packaging” on 11/21 at 1:45 PM.
URL:https://microsanj.com/events/ieee-repp-symposium-2025/
LOCATION:SEMI Headquarters\, 673 S Milpitas Blvd\, Milpitas\, CA\, 95035\, United States
CATEGORIES:Symposium
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END:VEVENT
END:VCALENDAR