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X-WR-CALDESC:Events for Microsanj
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DTSTART:20250101T000000
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DTSTART;VALUE=DATE:20260826
DTEND;VALUE=DATE:20260829
DTSTAMP:20260814T160626Z
CREATED:20260812T182327Z
LAST-MODIFIED:20260814T160626Z
UID:2971-1787702400-1787961599@microsanj.com
SUMMARY:ASPS 2026
DESCRIPTION:Microsanj’s Korea representative\, ROIENTEC\, is exhibiting at the Advanced Semiconductor Packaging & Chiplet Show (ASPS) 2026\, and we’d love to see you there. \nASPS gathers South Korea’s packaging community around the technologies driving the industry forward: advanced packaging\, chiplets\, and HBM. As devices move to 3D heterogeneous integration\, understanding heat flow inside the package is more critical than ever. \nStop by Booth L109 to see how Microsanj’s thermoreflectance platforms deliver: \n\nSub-micron\, full-field thermal imaging of active devices and stacked die\nDepth-resolved characterization of TSVs\, interposers\, and TIMs\nIn-plane & cross-plane thermal conductivity of thin films and packaging materials\n\nThe ROIENTEC team and Microsanj Co-Founder & CEO Dr. Mo Shakouri will be on hand to discuss your packaging and thermal challenges. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/asps-2026/
LOCATION:Private: Suwon Convention Center\, 140 Gwanggyojungang-ro\, Yeongtong-gu\, Suwon-si\, Gyeonggi-do\, Korea\, Democratic People's Republic of
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/08/Logo-e1786559129274.png
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