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X-WR-CALDESC:Events for Microsanj
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DTSTART:20240101T000000
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DTSTART;VALUE=DATE:20250805
DTEND;VALUE=DATE:20250808
DTSTAMP:20250714T175333Z
CREATED:20250711T184140Z
LAST-MODIFIED:20250714T175333Z
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SUMMARY:ICEPT 2025
DESCRIPTION:The International Conference on Electronic Packaging Technology (ICEPT) is one of the largest and most cohesive packaging technology conferences in Asia. ICEPT 2025 will be held by Shanghai University\, IEEE Electronics Packaging Society (IEEE-EPS)\, and Electronic Manufacturing & Packaging Technology Society of the Chinese Institute of Electronics (CIE-EMPT). \nWe’re excited to announce that Dr Andrew Tay\, our international representative\, will present an Invited Talk titled “Thermal and Failure Analysis of Advanced Microelectronic Devices” at ICEPT 2025 on August 7. \nDrawing from over 35 years of experience\, Andrew will cover real-world case studies in thermal and failure analysis of advanced microelectronic devices.
URL:https://microsanj.com/events/icept-2025-26th-international-conference-on-electronic-packaging-technology/
LOCATION:Sheraton Shanghai Jiading Hotel\, 66 Jiatang Hwy\, Jiading District\, Shanghai\, 201800\, China
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/jpeg:https://microsanj.com/wp-content/uploads/2025/07/logo.jpg
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