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X-WR-CALDESC:Events for Microsanj
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DTSTART:20250101T000000
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20261119
DTEND;VALUE=DATE:20261121
DTSTAMP:20261027T143145Z
CREATED:20261027T143145Z
LAST-MODIFIED:20261027T143145Z
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SUMMARY:Workshop on Energy Efficient Thermal Management at Chip Scale for Heterogeneous Integration (HI)
DESCRIPTION:Microsanj is excited to announce that our Co-Founder & CEO will be participating in Session 1\, “Advanced Thermal Materials and Passive Solutions\,” at Georgia Tech’s Workshop on Energy-Efficient Thermal Management for Chip-Scale Heterogeneous Integration (HI) this November. \nThe workshop on Energy-Efficient Chip-Scale Thermal Management for HI will convene experts in advanced thermal materials\, thermal characterization\, on-chip cooling technologies\, and emerging circuit architectures to address the emerging thermal needs of HI systems.
URL:https://microsanj.com/events/workshop-on-energy-efficient-thermal-management-at-chip-scale-for-heterogeneous-integration-hi/
LOCATION:Marcus Nanotechnology Building\, 345 Ferst Dr NW\, Atlanta\, GA\, 30332\, United States
CATEGORIES:Workshop
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20261201
DTEND;VALUE=DATE:20261205
DTSTAMP:20261021T191229Z
CREATED:20261021T191229Z
LAST-MODIFIED:20261021T191229Z
UID:3104-1796083200-1796428799@microsanj.com
SUMMARY:EPTC 2026
DESCRIPTION:The IEEE Electronics Packaging Technology Conference (EPTC) is an annual international event organized by the IEEE RS/EPS/EDS Singapore Joint Chapter and co-sponsored by the IEEE Electronics Packaging Society (EPS)\, and it will be held in Singapore. \nAli Shakouri will be presenting “3D Depth Analysis of Multilayer Thermal Materials and Packages.” Please check back here for more details. \nRegister Now
URL:https://microsanj.com/events/eptc-2026/
LOCATION:Sands Expo & Convention Centre\, 10 Bayfront Ave\, 018956\, Singapore
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2026/10/Logo-e1792609940405.png
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20261206
DTEND;VALUE=DATE:20261210
DTSTAMP:20261021T201307Z
CREATED:20261021T191855Z
LAST-MODIFIED:20261021T201307Z
UID:3108-1796515200-1796860799@microsanj.com
SUMMARY:IEEE-IDSPS 2026
DESCRIPTION:The IEEE-IDSPS conference covers all design\, semiconductor\, packaging\, and system technologies from science to technology to manufacturing\, supporting India’s transition into a product nation. \nOur Co-Founder & CEO\, Mo Shakouri\, will be presenting “Meeting Emerging Thermal Challenges of 3D Heterogeneously\nIntegrated Circuit Packaging Techniques.” Please check back here for more details. \nRegister Now
URL:https://microsanj.com/events/ieee-idsps-2026/
LOCATION:Novotel Visakhapatnam\, Beach Rd\, Krishna Nagar\, Maharani Peta\, Visakhapatnam\, Andhra Pradesh\, 530002\, India
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/jpeg:https://microsanj.com/wp-content/uploads/2026/10/IDSPS-logo-e1792610399981.jpg
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