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X-WR-CALDESC:Events for Microsanj
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DTSTART;VALUE=DATE:20260526
DTEND;VALUE=DATE:20260530
DTSTAMP:20260427T175040Z
CREATED:20260323T152549Z
LAST-MODIFIED:20260427T175040Z
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SUMMARY:ITherm 2026
DESCRIPTION:We’re pleased to announce that we are gold sponsors. Come visit us on the exhibit floor for a demo\, and don’t miss our sponsored presentation on Friday\, May 29\, from 11:30–11:45 AM in Room 3. \nITherm 2026 will be held alongside the 76th Electronic Components and Technology Conference (ECTC 2026 – http://www.ectc.net)\, a premier electronics packaging conference\, at the JW Marriott Orlando\, Grande Lakes\, Orlando\, Florida\, USA. Joint registrations will be available at a discounted rate. In addition to paper presentations and vendor exhibits\, ITherm 2026 will include panel discussions\, keynote lectures by prominent speakers\, invited technology talks\, ECTC/ITherm joint networking events and short courses\, and a student design competition. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/itherm-2026/
LOCATION:JW Marriott Orlando\, Grande Lakes\, 4040 Central Florida Parkway\, Orlando\, FL\, 32837\, United States
CATEGORIES:Trade Shows
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DTSTART;VALUE=DATE:20260526
DTEND;VALUE=DATE:20260530
DTSTAMP:20260420T210814Z
CREATED:20260323T153141Z
LAST-MODIFIED:20260420T210814Z
UID:1956-1779753600-1780099199@microsanj.com
SUMMARY:ECTC 2026
DESCRIPTION:The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging\, components\, and microelectronic systems science\, technology\, and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT). \nWe’re proud to announce our sponsorship of the 2026 IEEE EPS Heterogeneous Integration Roadmap (HIR) Workshop at ECTC in Orlando\, FL. \nThis full-day workshop on Tuesday\, May 26 brings together leaders in advanced packaging to discuss the technologies shaping our industry’s future. The day features four technical sessions covering topics including Additive Electronics Manufacturing (AME) for Advanced Packaging and CHIPS R&D Metrology\, chaired by Ravi Mahajan of Intel Corporation and William Chen of ASE. \nAs thermal imaging plays an increasingly critical role in heterogeneous integration and advanced packaging\, Microsanj is honored to support the important work happening in this space. \nRegister Now \nSchedule a meeting with us \n 
URL:https://microsanj.com/events/ectc-2026/
LOCATION:JW Marriott Orlando\, Grande Lakes\, 4040 Central Florida Parkway\, Orlando\, FL\, 32837\, United States
CATEGORIES:Trade Shows
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