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X-WR-CALDESC:Events for Microsanj
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DTSTART;VALUE=DATE:20251116
DTEND;VALUE=DATE:20251121
DTSTAMP:20251028T145506Z
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SUMMARY:ISTFA 2025
DESCRIPTION:Microsanj will join the 51st International Symposium for Testing and Failure Analysis (ISTFA) in Pasadena\, CA. As the premier event for the microelectronics failure analysis community\, ISTFA offers a platform for innovation and collaboration. \nVisit Microsanj at Booth #714 to experience a live demonstration of our EZ-THERM system\, showcasing open test and the powerful combination of Infrared (IR) and Thermoreflectance (TR) thermal analysis. Discover how our advanced tools provide precise\, non-invasive thermal characterization for today’s high-performance devices. Please speak with our experts to discuss how Microsanj solutions can support your specific research and reliability needs. \nView Floorplan
URL:https://microsanj.com/events/istfa-2025/
LOCATION:Pasadena Convention Center\, 300 E Green St\, Pasadena\, CA\, 91101\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2025/04/ISTFA-Logo.png
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DTSTART;VALUE=DATE:20251120
DTEND;VALUE=DATE:20251122
DTSTAMP:20251028T145435Z
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UID:1682-1763596800-1763769599@microsanj.com
SUMMARY:IEEE REPP Symposium 2025
DESCRIPTION:The 2025 IEEE REPP is a two-day technical event focused on Reliability for Electronics and Photonics Packaging and is taking place at the SEMI Headquarters in Milpitas\, CA! \nMicrosanj is excited to announce that we are a silver sponsor for this event\, and our very own Dustin Kendig will be presenting “Thermal Analysis Techniques to Address the Growing Thermal Challenges with Heterogeneous Packaging” on 11/21 at 1:45 PM.
URL:https://microsanj.com/events/ieee-repp-symposium-2025/
LOCATION:SEMI Headquarters\, 673 S Milpitas Blvd\, Milpitas\, CA\, 95035\, United States
CATEGORIES:Symposium
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2025/10/Screenshot-2025-10-28-at-7.50.11-AM.png
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