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X-WR-CALNAME:Microsanj
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X-WR-CALDESC:Events for Microsanj
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DTSTART:20240101T000000
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20251021
DTEND;VALUE=DATE:20251025
DTSTAMP:20251013T145016Z
CREATED:20250711T184812Z
LAST-MODIFIED:20251013T145016Z
UID:1504-1761004800-1761350399@microsanj.com
SUMMARY:IMPACT 2025
DESCRIPTION:IMPACT 2025 adopts the theme “Energy-Efficient AI: From Cloud to Edge\,” reflecting the industry’s increasing focus on high-performance\, low-power solutions. As AI applications continue to expand—from data centers to edge devices—the need for advanced PCB\, IC substrates\, heterogeneous integration\, and packaging technologies has become increasingly critical. \nPresentation AnnouncementSpeaker: Andrew TaySession: S15 – Power ElectronicsDate & Time: Wednesday\, October 22 | 10:10–10:40 AMTitle: Thermal and Failure Analysis of Advanced Microelectronic Devices \nOur rep\, Andrew Tay\, will explore advanced thermal analysis techniques for today’s high-power\, miniaturized devices. His talk highlights how thermoreflectance thermography enables sub-micron\, picosecond-resolution mapping to reveal hotspots and characterize thermal behavior non-destructively. He will also present a novel method using quantum spin crossover (SCO) materials to correlate electromagnetic power with temperature—offering a faster\, cost-effective approach for antenna field analysis—supported by real-world case studies.
URL:https://microsanj.com/events/impact-2025/
LOCATION:Private: 5F Taipei Nangang Exhibition Center (Hall 1)\, No.1\, Jingmao 2nd Rd.\, Nangang District\, Taipei City\, 11568\, Taiwan
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2025/07/logo.png
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