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X-WR-CALDESC:Events for Microsanj
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DTSTART;VALUE=DATE:20250921
DTEND;VALUE=DATE:20250927
DTSTAMP:20250903T145639Z
CREATED:20250207T222549Z
LAST-MODIFIED:20250903T145639Z
UID:296-1758412800-1758931199@microsanj.com
SUMMARY:EuMW 2025
DESCRIPTION:European Microwave Week (EuMW) 2025 is Europe’s premier event dedicated to microwave\, RF\, wireless\, and radar technologies. EuMW 2025 will feature three cutting-edge conferences\, industry-led workshops\, and a world-class exhibition showcasing the latest innovations in microwave and wireless engineering. The event brings together academics\, researchers\, and industry professionals to explore advancements in 5G/6G\, automotive radar\, IoT\, aerospace\, and defense applications\, fostering collaboration and technological progress in the field. Microsanj will be exhibiting in Booth A140 and also with our partner\, MPI Corporation\, at Booth E046. \n👉 Stay tuned for a big announcement from Microsanj during EuMW 2025! \nRegister Now \nView Floorplan \n📡 6G Forum\nDate & Time: Monday\, September 22 | 9:00 AM – 8:00 PM \nDemo: RF Power + Loss MappingEZ-THERM System: Visualizing RF Power Dissipation & EM Field Distribution \nWhat You’ll See:Using the EZ-THERM system\, we’ll visualize thermal patterns caused by current density and RF power dissipation on active transmission lines and RF components. You’ll observe how mismatches\, losses\, and radiation effects generate localized hot spots\, highlighting areas of inefficiency or potential failure. \nWhy It Matters:Thermal signatures provide insight into the electric field distribution and energy losses across your RF layout. This demo helps engineers correlate thermal and electrical behavior—essential for identifying design flaws\, verifying simulations\, and optimizing system reliability and performance. \nApplications: \n\n5G/6G RF Module & MMIC Testing\nSemiconductor Device Analysis\nPower Electronics Thermal Analysis\n\n\n🔬 Microsanj Booth (A140)\nExhibition Opening Times: \n\nTuesday\, September 23: 9:30 AM – 6:00 PM\nWednesday\, September 24: 9:30 AM – 5:30 PM\nThursday\, September 25: 9:30 AM – 4:30 PM\n\n🔧 Demo 1: High-Speed + High-Power GaN\nEZ-THERM System Thermal Imaging \nWhat You’ll See:Watch the EZ500 in action as it captures live thermal behavior of a GaN device using our high-resolution\, motorized probe station. Experience real-time\, picosecond-level thermal imaging that reveals rapid junction temperature spikes and elusive hot spots invisible to traditional tools. \nWhy It Matters:This is next-gen thermal analysis—ideal for engineers pushing GaN devices to their limits. With 250 nm spatial resolution and 500 ps temporal resolution\, it uncovers hidden hot spots and rapid thermal events that traditional tools simply miss. \nApplications: \n\nGaN Power Amplifier Testing\nHigh-Frequency Device Characterization\nTIM and Thermal Path Evaluation\nFailure Analysis & Process Integrity\nElectro-Thermal Modeling Support\n\n🌡️ Demo 2: EZ-THERM Discovery Zone\nHands-On Open Platform for Real-Time Thermal Analysis \nWhat You’ll See:Interact directly with our EZ-THERM system on a CPS probe station. Test various materials\, devices\, and layouts with instant thermal feedback—no specialized setup needed. Features Lock-In\, Flash Thermography\, and Open Circuit Detection. \nWhy It Matters:This is a fast\, flexible tool for researchers\, prototypers\, and product developers. Measure thermal maps of full PCBs or zoom down to 4.8 μm resolution—all in under a minute. \nApplications: \n\nMaterials & Prototyping Research\nThermal Characterization of Complex Layouts\nPCB and Chip-Level Analysis\nMEMS and Power IC Testing\n\n📡 Demo 3: RF Power + Loss Mapping\nEZ-THERM System: Visualizing RF Power Dissipation & EM Field Distribution \nWhat You’ll See:Using the EZ-THERM system\, we’ll visualize thermal patterns caused by current density and RF power dissipation on active transmission lines and RF components. You’ll observe how mismatches\, losses\, and radiation effects generate localized hot spots\, highlighting areas of inefficiency or potential failure. \nWhy It Matters:Thermal signatures provide insight into the electric field distribution and energy losses across your RF layout. This demo helps engineers correlate thermal and electrical behavior—essential for identifying design flaws\, verifying simulations\, and optimizing system reliability and performance. \nApplications: \n\n5G/6G RF Module & MMIC Testing\nSemiconductor Device Analysis\nPower Electronics Thermal Analysis\n\n\n🤝 MPI + Microsanj Joint Demo (E046)\nExhibition Opening Times: \n\nTuesday\, September 23: 9:30 AM – 6:00 PM\nWednesday\, September 24: 9:30 AM – 5:30 PM\nThursday\, September 25: 9:30 AM – 4:30 PM\n\n📡 Demo 4: MPI Automated Probe + Microsanj Thermal Imaging\nWhat You’ll See:Experience an automated MPI probe station integrated with the Microsanj thermal microscope\, enabling advanced thermal imaging for devices operating up to 250 GHz. Watch as high-speed\, high-resolution analysis reveals hidden hot spots and thermal dynamics during active device operation. \nWhy It Matters:This powerful combination delivers next-level insight for engineers working with cutting-edge RF and mmWave devices. With sub-micron spatial resolution and picosecond-level temporal response\, it provides unmatched visibility into thermal behavior at extreme frequencies. \nApplications: \n\n5G/6G and mmWave Device Characterization\nHigh-Frequency GaN and GaAs Testing\nReliability and Lifetime Prediction\nAdvanced RF Module Development\nElectro-Thermal Modeling & Validation
URL:https://microsanj.com/events/eumw-2025/
LOCATION:Jaarbeurs Convention Centre\, Jaarbeursplein 6\, 3521 AL\, Utrecht\, Netherlands
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2025/02/EuMW-e1738967125985.png
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