BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Microsanj - ECPv6.18.2//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-WR-CALNAME:Microsanj
X-ORIGINAL-URL:https://microsanj.com
X-WR-CALDESC:Events for Microsanj
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:UTC
BEGIN:STANDARD
TZOFFSETFROM:+0000
TZOFFSETTO:+0000
TZNAME:UTC
DTSTART:20240101T000000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;VALUE=DATE:20250804
DTEND;VALUE=DATE:20250808
DTSTAMP:20250711T184219Z
CREATED:20250711T175026Z
LAST-MODIFIED:20250711T184219Z
UID:1484-1754265600-1754611199@microsanj.com
SUMMARY:TFAWS 2025
DESCRIPTION:The Thermal and Fluids Analysis Workshop (TFAWS) is an annual training and professional development workshop that is designed to encourage knowledge sharing\, professional development\, and networking throughout the thermal and fluids engineering community within NASA and the aerospace community at large. The vision of TFAWS is to maintain continuity over time and between disciplines throughout the thermal and fluids engineering community. \nMicrosanj is pleased to announce that we will be exhibiting and hosting a demo session at TFAWS 2025 in San Jose\, CA! Check back here for more details!
URL:https://microsanj.com/events/tfaws-2025-thermal-fluids-analysis-workshop/
LOCATION:Diaz Compean Student Union\, One Washington Sq\, San Jose\, CA\, 95192\, United States
CATEGORIES:Workshop
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2025/07/Screenshot-2025-07-11-at-10.47.56 AM.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20250805
DTEND;VALUE=DATE:20250808
DTSTAMP:20250714T175333Z
CREATED:20250711T184140Z
LAST-MODIFIED:20250714T175333Z
UID:1496-1754352000-1754611199@microsanj.com
SUMMARY:ICEPT 2025
DESCRIPTION:The International Conference on Electronic Packaging Technology (ICEPT) is one of the largest and most cohesive packaging technology conferences in Asia. ICEPT 2025 will be held by Shanghai University\, IEEE Electronics Packaging Society (IEEE-EPS)\, and Electronic Manufacturing & Packaging Technology Society of the Chinese Institute of Electronics (CIE-EMPT). \nWe’re excited to announce that Dr Andrew Tay\, our international representative\, will present an Invited Talk titled “Thermal and Failure Analysis of Advanced Microelectronic Devices” at ICEPT 2025 on August 7. \nDrawing from over 35 years of experience\, Andrew will cover real-world case studies in thermal and failure analysis of advanced microelectronic devices.
URL:https://microsanj.com/events/icept-2025-26th-international-conference-on-electronic-packaging-technology/
LOCATION:Sheraton Shanghai Jiading Hotel\, 66 Jiatang Hwy\, Jiading District\, Shanghai\, 201800\, China
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/jpeg:https://microsanj.com/wp-content/uploads/2025/07/logo.jpg
END:VEVENT
END:VCALENDAR